FAQ
Q.
No Tin Whisker Risk in TDK MLCCs (2): What bath compositions are used for electroplating process?
  • Kondensatoren
    • >
  • Keramik-Vielschichtkondensatoren (MLCC)

A. The bath composition is typical Watts Nickel and typical Methyl Sulfonic Acid Tin (slightly acidic, pH = 4). Our plating chemistry is Pb free and provides 100% Ni deposit at 1.25 +/- 0.25um (～2um grain size) and 100% Sn deposit at 4.0 =/- 1.0um (～5um grain size).


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All related FAQ
Q.
No Tin Whisker Risk in TDK MLCCs (1): What material is used for the internal electrodes and terminal electrodes?
  • Keramik-Vielschichtkondensatoren (MLCC)
Q.
No Tin Whisker Risk in TDK MLCCs (3): How does TDK ensure the tin finish will not promote whisker growth?
  • Keramik-Vielschichtkondensatoren (MLCC)
Q.
No Tin Whisker Risk in TDK MLCCs (4): How does TDK test for Sn whisker?
  • Keramik-Vielschichtkondensatoren (MLCC)