In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.

NFC ist eine Abkürzung für Near Field Communication; es handelt sich um eine Art drahtloser Kommunikation mit kurzer Reichweite.
NFC ist eine Funktion, die Datenkommunikation und Authentisierung durchführen kann, wenn zwei NFC-kompatible Geräte in die Nähe zueinander gebracht werden, und ihr Einsatz in Smartphones hat in den letzten Jahren stark zugenommen.
Auch in Peripheriegeräten einschließlich tragbarer Endgeräte, wie z.B. Smart-Uhren, ist ein zunehmender Einsatz von NFC zu beobachten.
NFC wird in vielen Situationen eingesetzt, u.a. beim bargeldlosen Bezahlen und bei der Authentifizierung von Verbindungen mit Peripheriegeräten, und es wird erwartet, dass es auf dem Weg zu einer berührungslosen Gesellschaft für noch vielfältigere Anwendungen eingesetzt werden wird.
Dieser Artikel stellt die wichtigsten Komponenten vor, die in NFC-Schaltungen verwendet werden: NFC-Antenne, Magnetblech, LC-Filterinduktivität, Ein-End-Schaltungsbalun und elektrischer Doppelschichtkondensator (EDLC/Superkondensator).

Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In addition to explaining the characteristics of C0G MLCCs with high withstand voltage, this section focuses on the advantages of replacing the film capacitors used in EV wireless power transfer systems.

This section mainly explains the advantages of using MLCCs to replace film capacitors in the onboard chargers (OBC) of plug-in charging systems.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

PCB Deflection Countermeasure, Acoustic Noise Countermeasure and Noise Countermeasures in Automotive DC Motors in MLCC with Dippled Radial Lead

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).