Traditionally, aluminum electrolytic capacitors and tantalum electrolytic capacitors have been widely used for smoothing and decoupling applications that require large capacitance. With increasing capacitance values, MLCCs are replacing various electrolytic capacitors in power circuits and other applications.
Replacing electrolytic capacitors with MLCCs offers various benefits such as space reduction due to smaller size and lower profile, reduced ripple voltage due to low ESR, and improved reliability due to reduced self-heating.
On the other hand, low ESR, which is an advantage of MLCCs, can sometimes lead to abnormal oscillation or anti-resonance. Additionally, high dielectric constant MLCCs (Class 2) exhibit a characteristic capacitance change when DC voltage is applied, so caution is necessary.
This guide explains the advantages and precautions to be taken when replacing electrolytic capacitors with MLCCs.

NFC ist eine Abkürzung für Near Field Communication; es handelt sich um eine Art drahtloser Kommunikation mit kurzer Reichweite.
NFC ist eine Funktion, die Datenkommunikation und Authentisierung durchführen kann, wenn zwei NFC-kompatible Geräte in die Nähe zueinander gebracht werden, und ihr Einsatz in Smartphones hat in den letzten Jahren stark zugenommen.
Auch in Peripheriegeräten einschließlich tragbarer Endgeräte, wie z.B. Smart-Uhren, ist ein zunehmender Einsatz von NFC zu beobachten.
NFC wird in vielen Situationen eingesetzt, u.a. beim bargeldlosen Bezahlen und bei der Authentifizierung von Verbindungen mit Peripheriegeräten, und es wird erwartet, dass es auf dem Weg zu einer berührungslosen Gesellschaft für noch vielfältigere Anwendungen eingesetzt werden wird.
Dieser Artikel stellt die wichtigsten Komponenten vor, die in NFC-Schaltungen verwendet werden: NFC-Antenne, Magnetblech, LC-Filterinduktivität, Ein-End-Schaltungsbalun und elektrischer Doppelschichtkondensator (EDLC/Superkondensator).

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.