This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).