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In response to the market demand for a reduced risk MLCC with respect to board flexure cracks, TDK introduced a unique inner electrode design that compensates for the typical crack path induced by PCB bending. This "Y" crack has been well documented as a signature crack for board flexure  and has been a leading cause of MLCC failures in the market for years.
Excessive board bending during PCB manufacturing or final assembly is common, and the brittle nature of ceramic components is especially prone to damage after soldered to the PCB. TDK has responded to this problem with the Open Mode MLCC for applications where flex cracking is a high concern (see illustration in Figure 1).
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