Multilayer Ceramic Chip Capacitors

TDK item description  ?
C0816X7S0G474MT****
Applications
Commercial GradeCommercial Grade
Feature
L⇔WLow ESL Reverse Geometry
Series
C0816 [EIA 0306]
Status
EOL announcedEOL announced
Discontinue Issue Date : Apr.28, 2018
Last Purchase Order Date : Oct.31, 2018
Last Shipment Date : Mar.31, 2019

Images are for reference only and show exemplary products.

Size

Length(L)
0.80mm ±0.10mm
Width(W)
1.60mm ±0.10mm
Thickness(T)
0.50mm ±0.10mm
Terminal Width(B)
0.10mm Min.
Recommended Land Pattern (PA)
0.30mm Nom.
Recommended Land Pattern (PB)
0.35mm Nom.
Recommended Land Pattern (PC)
1.60mm Nom.

Electrical Characteristics

Capacitance
470nF ±20%
Rated Voltage
4VDC
Temperature Characteristic  ?
X7S(±22%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
212MΩ

Other

Soldering Method
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
4000pcs

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)