Chip Beads
MMZ2012Y600BT000
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Recommended Land Pattern (A) |
|
| Recommended Land Pattern (B) |
|
| Recommended Land Pattern (C) |
|
Electrical Characteristics
| Impedance at 100MHz |
|
| Rated Current |
|
| DC Resistance (Max.) |
|
Other
| Operating Temp. Range (Including Self-Temp. Rise) |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| Weight |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C4520X7R3D102K130KE
Capacitance=1nF
Edc=2000V
T.C.=X7R
LxWxT:4.5x2x1.3mm
Soft termination
EMI Suppression Capacitors
B32033A4104M000
0.10uF, 350Vrms AC
10.5m(W) x 16.5m(H) x 26.5m(L)
Chip Beads
MMZ1005D241CT000
|Z|=240Ω at 100MHz
Rated current=200mA
L x W x T :
1mm x 0.5mm x 0.5mm
Chip Beads
MMZ1005D330CT000
|Z|=33Ω at 100MHz
Rated current=400mA
L x W x T :
1mm x 0.5mm x 0.5mm
Chip Beads
MMZ1608S601ATA00
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MMZ1608Y600BTA00
|Z|=60Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MMZ1608Y600BTD25
|Z|=60Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MMZ2012D121BT000
|Z|=120Ω at 100MHz
Rated current=500mA
L x W x T :
2mm x 1.25mm x 0.85mm
Chip Beads
MMZ2012D301BT000
|Z|=300Ω at 100MHz
Rated current=400mA
L x W x T :
2mm x 1.25mm x 0.85mm
Chip Beads
MMZ2012D800BT000
|Z|=80Ω at 100MHz
Rated current=500mA
L x W x T :
2mm x 1.25mm x 0.85mm