TDK Corporation (TSE:6762) presents the new T850 SMT NTC sensor (B57850T0103*) for measuring surface temperatures. It combines high humidity resistance with fast response time due to excellent thermal coupling to the target. The sensor is suitable for harsh environments with temperatures from -40 °C to +150 °C and is waterproof for up to 500 hours. In addition, the sensor, with its aluminum oxide ceramic surface, offers a high dielectric strength of 2500 V AC for 60 s.

TDK Corporation presents the ultrasonic sensor module USSM1.0 PLUS-FS, in which the sensor element is mechanically decoupled from the housing. This makes the IP65/67 protected sensor with the order number B59110W2111W032 immune to external mechanical vibrations that can falsify the measurement result. The module, which is supplied with a nominal voltage of 12 V, can be mounted in a front chassis via a M19 thread with a locking nut or via snap hooks.

TDK Corporation (TSE:6762) has announced the introduction of its new NTCWS series of NTC thermistors, available with Au wire bonding. These bondable NTC thermistors can be mounted with Au wire bonding inside the package for highly accurate temperature detection of laser diodes (LDs) used for optical communication. Mass production of the product series began in September 2023.

The use of LD devices in optical communication transceivers is increasing, as typified by 5G and LiDAR used for inter-vehicle distance measurement. Since the wavelength of LDs changes with temperature, controlling the temperature of LDs is the key to improving their performance.

TDK Corporation (TSE:6762) presents a development starter kit for fast haptics prototyping. It gives mechanical designers and engineers first impressions of the haptic feedback with PowerHap™ piezo actuators, shows how the mechanical integration works, and provides a reference design, which can be adapted to various applications. PowerHap piezo actuators offer an unprecedented quality of haptic feedback based on their unrivaled performance of acceleration, force, and response time. Example applications include automotive (e.g., steering wheels, displays, dashboards, buttons), smartphones, displays and tablets, household appliances, ATMs and vending machines, game controllers, VR gloves, industrial equipment, and medical devices.

TDK Corporation (TSE:6762) presents the new EPCOS B43657* aluminum electrolytic capacitor series with snap-in terminals. The capacitors achieve a service life of at least 2000 h at a maximum operating temperature of 105 °C and cover a rated voltage range from 450 V DC to 475 V DC with capacitance values from 120 µF to 1250 μF. An important performance feature is their high ripple current capability of up to 8.54 A (120 Hz, 60 °C). Accurate lifetime calculation under application-specific conditions is quick and easy with the online AlCap Tool.

The VLS series power inductors are magnetic shield (resin) type wound inductors that have been developed taking full advantage of the material technology and manufacturing processes that TDK have accumulated so far. This type of inductors can largely be classified into three categories: VLS-HBX/HBU series, VLS-CX/CX-H series, and VLS-EX/AF/EX-H/EX-D series; and they show respective excellent features. This article introduces the structure, features, and application purposes of these products, and other information that helps you in an easy-to-understand way.

TDK Corporation presents two new piezo actuators made of RoHS-compatible lead zirconate titanate (PZT) with an internal copper electrode. COM30S5 (B58004M4030A020) and COM45S5 (B58004M4040A020) are available as unhoused, passivated components. They are characterized by an extraordinary dynamic range, a high force-to-volume ratio, and precision in the nanometer range. TDK achieves this through its patented copper-based High Active Stack (HAS) technology. Compared to other technologies, HAS piezo actuators from TDK offer superior performance, robustness to moisture, and a longer lifetime.

TDK Corporation (TSE:6762) presents HVC27 (B88269X*), its new generation of high-voltage contactors that can safely and reliably switch off continuous DC currents of 300 A to 500 A and operating DC voltages of up to 1000 V in lithium-ion batteries in 20 ms or less, depending on the type. This is made possible by the gas-filled ceramic arc chamber which is also used in the other HVC types from TDK. Completely new is the optional Hall-effect sensor for the auxiliary contact. It is used to detect the switching state of the main contacts. The bidirectional design allows only one HVC27 to charge and discharge batteries as well as to power motor drive systems and do regenerative braking (recuperation).

The HPL Series of power inductors for automotive applications is a low inductance product, developed by TDK using proprietary ferrite materials and coil structure.
It is characterized by its ability to handle large currents with high efficiency, making it ideal for circuits requiring large currents, such as ADAS image processing circuits. Additionally, due to its unique structure with no connection points, it ensures high reliability with reduced risk of open defects.
In this article, we will explain the structure, features, and applications of the HPL Series in an easy-to-understand manner that is useful for everyone.

TDK Corporation (TSE:6762) presents new series of extremely compact TVS diodes with parameters matched to the various ports of the USB-C port as well as other high-speed interfaces. TVS diodes with very low parasitic capacitance values and low clamping voltage are required especially for the high-speed ports (Tx / Rx) of USB-C, which operate at up to 40 Gbit/s with USB4 version 1. The B74111U0033M060 and B74121U0033M060 types are suitable for this purpose, with very low capacitance values of 0.48 pF and 0.65 pF at 1 MHz, respectively, which means that signal integrity is not compromised. The clamping voltages are only 3.8 V or 3.9 V with an ITLP of 8 A. The protection devices are designed for ESD discharge voltages of up to 15 kV. These TVS diodes are manufactured in the extremely compact WLCSP 01005 and WLCSP 0201 packages and are extremely flat with heights of 100 µm and 150 µm respectively. This means that the TVS diodes can also be integrated into USB-C SIP modules.