The SPM series power inductors are the metal composite type wire-wound inductors that have the coils integrally molded with metallic magnetic powder. Compared to ferrite-base wire-wound inductors, the SPM series inductors realize larger current, lower Rdc, smaller size and superior DC bias characteristic. In addition, they ensure low magnetic flux leakage and are effective as a means to suppress acoustic noise of the coil. This article introduces the structure, features, and application of these products, and other information that helps you in an easy-to-understand way.

The TFM series of power inductors consists of compact, thin inductors developed with the skillful application of the thin-film processing techniques acquired by TDK throughout its past. By using metallic magnetic materials with high saturation magnetic flux densities, these products have furthermore achieved the outstanding DC superimposition characteristics required of power inductors. This article clearly describes and explains valuable information for our customers related to the products in the TFM series, including their structures, features, and uses.

TDK Corporation presents the CLT32 series power inductors with extremely compact dimensions and excellent electrical values thanks to their new design. The nine types cover an inductance range of 17 nH to 440 nH and are designed for 13.5 A to 60 A saturation currents. With a compact footprint of 3.2 x 2.5 mm and an insertion height of 2.5 mm, these are the most compact SMT power inductors in their performance class. They are constructed for a temperature range of -40 °C to 165 °C including self-heating.

TDK Corporation (TSE: 6762) introduces the new PCM120T series of shielded SMT power inductors, optimized for high saturation currents and low DC resistances. The PCM120T product family includes 14 inductance values between 0.4 μH and 10 μH, whereby saturation currents of up to 80 A are reached depending on the L value. Optimal saturation properties are achieved through the use of an iron alloy core. Flat wire windings are used to keep losses as low as possible. This results in low ohmic resistance values (RDC) of 0.72 mΩ (0.4 μH) to 9 mΩ (10 μH). The new inductors have an outstanding EMC performance due to closed housing made of ferrite material without an external gap. They are ideal for automatic solder joint inspection (AOI) and achieve a coplanarity of <0.1 mm due to their lead frame structure. The product’s metal cores provide resistance against high voltage pulses in accordance with ISO7636. The components’ dimensions are 12.7 x 15.8 x 11.5 mm (W x L x H). The powerful RoHS-compatible inductors are designed for a wide temperature range from -55 °C to +165 °C and are certified according to AEC-Q200.

With the spread of cloud computing and smartphones and the launch of 5G in 2020, the amount of data that moves on the internet is increasing as high-volume video and game data is added to existing documents, images, and sound data.
In addition, technologies are evolving, exemplified by AI, and a digital transformation (DX) is taking place as a result of the use of big data and the internet of things (IoT). To support these advances, however, large numbers of high-performance servers that can process large volumes of data will be needed. In conjunction with the increased performance of processors and various types of ICs, higher clock speeds of power supply ICs on server boards, high current power saving, miniaturization, noise countermeasures in data lines, and surge countermeasures have become urgent issues. Here, we introduce TDK products for addressing and solving these problems including the VLBU series of ferrite power inductors compatible with the high-efficiency needs of VR13 and VR14 applications, the FS series of DC-DC converters with embedded μPOL™, solutions using the ALT series of pulse transformers and ALC series of common mode filters and chokes, and chip varistors and ceramic transient voltage suppressors used for surge protection.

NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).

The number of smartphones and other mobile devices that are compatible with NFC (Near Field Communication) is increasing. Thanks to the adoption of a newly-developed low-loss ferrite material, TDK’s MLJ series multilayer ferrite coils now offer improved communication properties which are ideal for NFC-equipped devices, while featuring compact package sizes.

TDK Corporation has extended its range of dual inductors to include the new EPCOS series B82477D6*. The seven series types cover an inductance range from 2 x 3.9 µH to 2 x 47 µH and are designed for maximum rated currents from 2.83 A to 7.05 A. A special feature of the inductors, which are certified according to AEC-Q200 and compatible with RoHS, are the high saturation currents of up to 16.1 A. The magnetically shielded inductors have dimensions of just 12.5 x 12.5 x 10.5 mm3 and are designed for a wide temperature range of -55°C to +150 °C. Depending on the type, the inductors offer very high coupling factors of the two windings from 97 to 99 per cent.

As electronic devices become more advanced, the power supply voltage of LSIs used in them is lowered, so their power consumption can be reduced and their speed increased. However, a decrease in the power supply voltage also causes the requirements regarding voltage fluctuations to become more severe, creating a need for high-performance DC-DC converters to fulfill these characteristic requirements, and power inductors are important components that greatly affect their performance. TDK has a widely varied lineup of power inductor products, and this article describes and explains effective methods for using power inductors, and key points for selecting them, according to the required characteristics of DC-DC converters.

The VLS series power inductors are magnetic shield (resin) type wound inductors that have been developed taking full advantage of the material technology and manufacturing processes that TDK have accumulated so far. This type of inductors can largely be classified into three categories: VLS-HBX/HBU series, VLS-CX series, and VLS-EX/AF/EX-H series; and they show respective excellent features. This article introduces the structure, features, and application purposes of these products, and other information that helps you in an easy-to-understand way.