This is an electric double-layer capacitor with a metal foil laminate film (EDLC/supercapacitors).Low-resistance electric double-layer capacitors (EDLC/supercapacitors) are effective as capacitors for providing supplementary power during peak output, backup during power supply loss, energy harvesting, or regenerative energy storage. They are thin and lightweight, which makes them appealing for use in mobile products.

NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

TDK has been offering pouch-type EDLCs, and has developed a new ultra-thin EDLC, with a thickness of 0.45mm (max.) that can be stored inside an IC card. It realizes battery-less smart cards equipped with a display, and is suitable for secondary power supplies for wearable devices or IoT devices.

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).