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Q.No Tin Whisker Risk in TDK MLCCs (2): What bath compositions are used for electroplating process?

Capacitors >  Ceramic Capacitors >  Multilayer Ceramic Chip Capacitors

A. The bath composition is typical Watts Nickel and typical Methyl Sulfonic Acid Tin (slightly acidic, pH = 4). Our plating chemistry is Pb free and provides 100% Ni deposit at 1.25 +/- 0.25um (~2um grain size) and 100% Sn deposit at 4.0 =/- 1.0um (~5um grain size).


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