The most important applications of TDK’s wide range of RF components and modules include transmit and receive systems of mobile phones. They also perform additional key functions in applications such as navigation, Bluetooth connectivity and wireless LAN, as well as in automotive electronics like in remote keyless entry systems or automotive telematics.
The lineup of RF components includes discrete components such as SAW, BAW, LTCC and thin-film filters and duplexers, band-pass filters, baluns, diplexers, and antennas. Complementing the spectrum of discrete components is an array of highly integrated modules for the RF front-end, wireless connectivity and power management.
To meet the ongoing need for higher performance and reduced size of components in multimode and multiband-capable handsets, our products employ cutting-edge process, packaging and module technologies such as chip-sized SAW packaging (CSSP®), die-sized SAW packaging (DSSP®) and advanced thin-film acoustic packaging (TFAP™).