Q.Please explain the heat dissipation methods for power modules / onboard power supplies.

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A. They can be classified into two major types depending on the structure of the products.

(1) The type where the heat generated from mounted components is directly dissipated in the surrounding air
The heat generated from components mounted on products with exposed mounting boards is directly dissipated in the surrounding air.
The electrical power that can be outputted with this type of product can be increased when it is forcedly cooled with external fans (CC-E series have cases to cover their mounting boards but are classified as this type because they have intake ports for surrounding air and mold resin is not used). The operable temperatures are specified in the ambient temperatures with the type above.
Refer to the specifications, output deratings, and instruction manuals of the products for details.

(2) The type where heatsinks are attached for the use of heat conduction and dissipation in the surrounding air
Aluminum baseplate-type products (with heat-generating components mounted on aluminum plates) require the attaching of appropriate heatsink on their baseplates.
With this type, the heat generated from mounted components placed on the baseplates undergoes heat conduction (conduction cooling) in the heatsink through the baseplates and is efficiently dissipated in the surrounded air with the heatsink. This type is different from the one described above in that the operable temperatures are specified in the baseplate temperatures. It is adopted by products that have relatively large capacity and high levels of heat generation. It allows electrical power that can be outputted to be designed freely through the shape of the heatsink and forced cooling of the heatsink with an external fan (please contact usfor details).