Traditionally, aluminum electrolytic capacitors and tantalum electrolytic capacitors have been widely used for smoothing and decoupling applications that require large capacitance. With increasing capacitance values, MLCCs are replacing various electrolytic capacitors in power circuits and other applications.
Replacing electrolytic capacitors with MLCCs offers various benefits such as space reduction due to smaller size and lower profile, reduced ripple voltage due to low ESR, and improved reliability due to reduced self-heating.
On the other hand, low ESR, which is an advantage of MLCCs, can sometimes lead to abnormal oscillation or anti-resonance. Additionally, high dielectric constant MLCCs (Class 2) exhibit a characteristic capacitance change when DC voltage is applied, so caution is necessary.
This guide explains the advantages and precautions to be taken when replacing electrolytic capacitors with MLCCs.

One of the well-established key requirements in solar inverters is their high efficiency. But also, their costs, size and weight are subject to continuous improvements. One approach to better fulfil all these demanding requirements simultaneously is the use of multilevel topologies.
The main advantages of switching between multiple voltage levels are lower voltage stress for the semiconductors and lower ripple stress for the power chokes.
This means that lower-voltage semiconductors can be used, which are typically cheaper.
Lower ripple stress for the chokes makes smaller and thereby lighter and cheaper choke designs possible.
The flying capacitor topology is a multilevel topology, that is an interesting choice especially for (but not limited to) the booster stage of a solar inverter. As its name implies, it needs a capacitor as a key element. This article describes and compares possible TDK solutions therefor.

In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.

NFC ist eine Abkürzung für Near Field Communication; es handelt sich um eine Art drahtloser Kommunikation mit kurzer Reichweite.
NFC ist eine Funktion, die Datenkommunikation und Authentisierung durchführen kann, wenn zwei NFC-kompatible Geräte in die Nähe zueinander gebracht werden, und ihr Einsatz in Smartphones hat in den letzten Jahren stark zugenommen.
Auch in Peripheriegeräten einschließlich tragbarer Endgeräte, wie z.B. Smart-Uhren, ist ein zunehmender Einsatz von NFC zu beobachten.
NFC wird in vielen Situationen eingesetzt, u.a. beim bargeldlosen Bezahlen und bei der Authentifizierung von Verbindungen mit Peripheriegeräten, und es wird erwartet, dass es auf dem Weg zu einer berührungslosen Gesellschaft für noch vielfältigere Anwendungen eingesetzt werden wird.
Dieser Artikel stellt die wichtigsten Komponenten vor, die in NFC-Schaltungen verwendet werden: NFC-Antenne, Magnetblech, LC-Filterinduktivität, Ein-End-Schaltungsbalun und elektrischer Doppelschichtkondensator (EDLC/Superkondensator).

Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In addition to explaining the characteristics of C0G MLCCs with high withstand voltage, this section focuses on the advantages of replacing the film capacitors used in EV wireless power transfer systems.

This section mainly explains the advantages of using MLCCs to replace film capacitors in the onboard chargers (OBC) of plug-in charging systems.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

PCB Deflection Countermeasure, Acoustic Noise Countermeasure and Noise Countermeasures in Automotive DC Motors in MLCC with Dippled Radial Lead