Applications & Cases
[Application Note]
TDK, as part of its continued efforts to bring environmentally friendly technical solutions to the market, has recently developed a plating process that enables manufacturing of thick, highly precise copper patterns on thin-film substrates without using typical exposure/etching technologies. The copper deposition can be to one or both sides of the thin-film substrate to reduce the coil’s [antenna’s] DC resistance (DCR). This innovation has been achieved through an electro-plating process that uses a nano-dispersed organic polymer called polypyrrole (PPy), a material solution from Achilles Corporation and is combined with TDK’s internal process technology. TDK’s unique copper plating process employs an "additive” methodology, where copper is plated only on defined areas to form the required pattern and is in direct contrast to standard methods that etch away from a copper layer in a subtractive process. Additionally, by incorporating TDK’s proprietary high-performance magnetic shielding materials, end-product miniaturization can be realized.
TDK, as part of its continued efforts to bring environmentally friendly technical solutions to the market, has recently developed a plating process that enables manufacturing of thick, highly precise copper patterns on thin-film substrates without using typical exposure/etching technologies. The copper deposition can be to one or both sides of the thin-film substrate to reduce the coil’s [antenna’s] DC resistance (DCR). This innovation has been achieved through an electro-plating process that uses a nano-dispersed organic polymer called polypyrrole (PPy), a material solution from Achilles Corporation and is combined with TDK’s internal process technology. TDK’s unique copper plating process employs an "additive” methodology, where copper is plated only on defined areas to form the required pattern and is in direct contrast to standard methods that etch away from a copper layer in a subtractive process. Additionally, by incorporating TDK’s proprietary high-performance magnetic shielding materials, end-product miniaturization can be realized.