Q.
About the J-STD-020 Reflow profile
- Kondensatoren >
- Keramik-Vielschichtkondensatoren (MLCC)
A.【About the J-STD-020 Reflow profile 】
TDK MLCCs are compatible with the reflow condition defined in J-STD-020 by JEDEC (JEDEC Solid State Technology Association) below.
Depending upon the mounting conditions, such as solder type, solder amount and board design, mechanical/thermal stress levels should be considered.
Please verify the mounting conditions and performance by the actual circuit board.
【Profile Feature】
| Peak temp | Package thickness <2.5mm : 260℃ Package thickness >2.5mm : 250℃ (According to JEDEC J-STD-020, peak temperature 250℃ is applied for product > 2.5mm. In case of TDK MLCC, 260℃ is applicable also for >2.5mm also, except CKG Series.) |
|---|---|
| Time within peak temp-5℃ | 30sec Max. Package thickness 2.5mm and thinner : 255℃ Package thickness thicker than 2.5mm : 245℃ |
| Liquidus temp of solder | 217℃ (Sn-3.0Ag-0.5Cu) |
| Time above 217℃ | 60~150sec |
| Heating Gradient | - *1 |
| Cooling Gradient | Natural cooling *2 |
| Preheating condition | CGA5 (C3216) and smaller : ΔT≦150℃ CGA6 (C3225) and larger : ΔT≦130℃ |
- *1 : For heating gradient, please apply pre-heating with consideration of the gap of temperature DT between peak and pre-heat to avoid thermal shock.
- *2 : Natural cooling is recommended. In case of forced-air cooling, please confirm the mounting conditions and performance with consideration for solder type, solder amount, and board design.
