Keramik-Vielschichtkondensatoren (MLCC)
Automotive Grade
| Produktbild | Merkmale | Merkmale | Serie | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|---|
 |
General
|
General
(Up to 75Vdc) |
CGA series
|
Rated voltage: Up to 75Vdc
|
1142KB
|
1214KB
|
238KB
 |
240KB
|
 |
|
Rated voltage: Up to 75Vdc
Voltage derating |
1142KB
|
942KB
|
|
||||||
 |
Mid
|
Mid Voltage
(100 to 630Vdc) |
CGA series
|
Rated voltage: 100 to 630Vdc
|
875KB
|
1214KB
|
|
||
|
|
High
|
High Voltage
(1k to 3kVdc) |
CGA series
|
Rated voltage: 1k to 3kVdc
|
489KB
|
1097KB
|
|
||
|
|
150°C
|
High Temperature Application
|
CGA series
|
Operating temperature range: Up to 150ºC
|
584KB
|
1214KB
|
|
||
 |
Mega
|
MEGACAP
(with metal frame) |
CKG series
|
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
293KB
|
1167KB
|
|
||
 |
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(C0G type) |
421KB
|
907KB
|
|
||
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
915KB
|
|
|||||||
|
|
Soft
|
Soft Termination
|
CGA series
|
Resin relieves mechanical stress
(Up to 630Vdc) |
993KB
|
1157KB
|
|
||
|
Resin relieves mechanical stress
(1k to 3kVdc) |
969KB
|
|
|||||||
 |
Soft
LowR |
Soft Termination
Low Resistance |
CNA series
|
Integration of both high reliability and low resistance by original terminal structure
|
169KB
|
934KB
|
|
||
|
|
Serial
Soft |
Serial Design
Soft Termination |
CEU series
|
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
182KB
|
966KB
|
|
||
|
|
Glue
|
Conductive Epoxy Application
|
CGA series
|
AgPdCu termination reduces risk of silver migration
|
552KB
|
969KB
|
|
||
 |
L↔W
|
Low ESL
Reverse Geometry |
CGA series
|
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
153KB
|
1007KB
|
|
||
 |
ESD
|
ESD Protection
|
CGA3EA series
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
165KB
|
984KB
|
|
| Produktbild | Merkmale | Merkmale | Serie | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
CGA series
|
Rated voltage: Up to 75Vdc
|
1142KB
|
1214KB
|
238KB
|
240KB
|
|
|
|
General
|
General
(Up to 75Vdc) |
CGA series
|
Rated voltage: Up to 75Vdc
Voltage derating |
1142KB
|
942KB
|
238KB
|
240KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
CGA series
|
Rated voltage: 100 to 630Vdc
|
875KB
|
1214KB
|
238KB
|
240KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
CGA series
|
Rated voltage: 1k to 3kVdc
|
489KB
|
1097KB
|
238KB
|
240KB
|
|
|
|
150°C
|
High Temperature Application
|
CGA series
|
Operating temperature range: Up to 150ºC
|
584KB
|
1214KB
|
238KB
|
240KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
CKG series
|
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
293KB
|
1167KB
|
238KB
|
240KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(C0G type) |
421KB
|
907KB
|
238KB
|
240KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
421KB
|
915KB
|
238KB
|
240KB
|
|
|
|
Soft
|
Soft Termination
|
CGA series
|
Resin relieves mechanical stress
(Up to 630Vdc) |
993KB
|
1157KB
|
238KB
|
240KB
|
|
|
|
Soft
|
Soft Termination
|
CGA series
|
Resin relieves mechanical stress
(1k to 3kVdc) |
993KB
|
969KB
|
238KB
|
240KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
CNA series
|
Integration of both high reliability and low resistance by original terminal structure
|
169KB
|
934KB
|
238KB
|
240KB
|
|
|
|
Serial
Soft |
Serial Design
Soft Termination |
CEU series
|
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
182KB
|
966KB
|
238KB
|
240KB
|
|
|
|
Glue
|
Conductive Epoxy Application
|
CGA series
|
AgPdCu termination reduces risk of silver migration
|
552KB
|
969KB
|
238KB
|
240KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
CGA series
|
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
153KB
|
1007KB
|
238KB
|
240KB
|
|
|
|
ESD
|
ESD Protection
|
CGA3EA series
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
165KB
|
984KB
|
238KB
|
240KB
|
|
Commercial Grade
| Produktbild | Merkmale | Merkmale | Serie | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
C series
|
Dimension: 0.4 x 0.2 [mm]
|
1655KB
|
387KB
|
238KB
|
240KB
|
|
|
Rated voltage: Up to 75Vdc
|
1655KB
|
1077KB
|
|
||||||
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
C series
|
Rated voltage: 100 to 630Vdc
|
1042KB
|
|
|||
|
|
High
|
High Voltage
(1k to 3kVdc) |
C series
|
Rated voltage: 1k to 3kVdc
|
520KB
|
919KB
|
|
||
 |
LowT
|
Low Profile
|
CGB series
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
883KB
|
|
||
|
|
150°C
|
High Temperature Application
|
C series
|
Operating temperature range: Up to 150ºC
|
639KB
|
1077KB
|
|
||
|
Operating temperature range: Up to 150ºC
Voltage derating |
889KB
|
|
|||||||
|
|
Mega
|
MEGACAP
(with metal frame) |
CKG series
|
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
1030KB
|
|
||
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(C0G type) |
419KB
|
1032KB
|
|
||
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
990KB
|
|
|||||||
|
|
Soft
|
Soft Termination
|
C series
|
Resin relieves mechanical stress
(Up to 630Vdc) |
656KB
|
536KB
|
|
||
|
Resin relieves mechanical stress
(1k to 3kVdc) |
922KB
|
|
|||||||
|
|
Soft
LowR |
Soft Termination
Low Resistance |
CNC series
|
Integration of both high reliability and low resistance by original terminal structure
|
165KB
|
943KB
|
|
||
|
|
L↔W
|
Low ESL
Reverse Geometry |
C series
|
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
934KB
|
|
||
 |
ULI
|
Low ESL
Ultra Low Inductance |
CLL series
|
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
144KB
|
889KB
|
|
| Produktbild | Merkmale | Merkmale | Serie | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
C series
|
Dimension: 0.4 x 0.2 [mm]
|
1655KB
|
387KB
|
238KB
|
240KB
|
|
|
|
General
|
General
(Up to 75Vdc) |
C series
|
Rated voltage: Up to 75Vdc
|
1655KB
|
1077KB
|
238KB
|
240KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
C series
|
Rated voltage: 100 to 630Vdc
|
1042KB
|
1077KB
|
238KB
|
240KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
C series
|
Rated voltage: 1k to 3kVdc
|
520KB
|
919KB
|
238KB
|
240KB
|
|
|
|
LowT
|
Low Profile
|
CGB series
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
883KB
|
238KB
|
240KB
|
|
|
|
150°C
|
High Temperature Application
|
C series
|
Operating temperature range: Up to 150ºC
|
639KB
|
1077KB
|
238KB
|
240KB
|
|
|
|
150°C
|
High Temperature Application
|
C series
|
Operating temperature range: Up to 150ºC
Voltage derating |
639KB
|
889KB
|
238KB
|
240KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
CKG series
|
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
1030KB
|
238KB
|
240KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(C0G type) |
419KB
|
1032KB
|
238KB
|
240KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
CA series
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
419KB
|
990KB
|
238KB
|
240KB
|
|
|
|
Soft
|
Soft Termination
|
C series
|
Resin relieves mechanical stress
(Up to 630Vdc) |
656KB
|
536KB
|
238KB
|
240KB
|
|
|
|
Soft
|
Soft Termination
|
C series
|
Resin relieves mechanical stress
(1k to 3kVdc) |
656KB
|
922KB
|
238KB
|
240KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
CNC series
|
Integration of both high reliability and low resistance by original terminal structure
|
165KB
|
943KB
|
238KB
|
240KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
C series
|
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
934KB
|
238KB
|
240KB
|
|
|
|
ULI
|
Low ESL
Ultra Low Inductance |
CLL series
|
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
144KB
|
889KB
|
238KB
|
240KB
|
|
