Keramik-Vielschichtkondensatoren (MLCC)
Automotive Grade
| Produktbild | Merkmale | Merkmale | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|
 |
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
902KB
|
1205KB
|
70KB
|
155KB
|
 |
 |
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
681KB
|
70KB
|
|
||
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
255KB
|
1079KB
|
70KB
|
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
635KB
|
1205KB
|
70KB
|
|
|
 |
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
298KB
 |
981KB
|
70KB
|
125KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
|
654KB
|
1133KB
|
70KB
|
155KB
|
|
 |
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance by original terminal structure
|
169KB
|
869KB
|
65KB
|
119KB
|
|
|
|
Serial
Soft |
Serial Design
Soft Termination |
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
186KB
|
946KB
|
70KB
|
155KB
|
|
|
|
Glue
|
Conductive Epoxy Application
|
AgPdCu termination reduces risk of silver migration
|
557KB
|
1097KB
|
70KB
|
|
|
 |
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
157KB
|
982KB
|
69KB
|
|
|
 |
ESD
|
ESD Protection
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
170KB
|
973KB
|
70KB
|
|
| Produktbild | Merkmale | Merkmale | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
902KB
|
1205KB
|
70KB
|
155KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
681KB
|
1205KB
|
70KB
|
155KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
255KB
|
1079KB
|
70KB
|
155KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
635KB
|
1205KB
|
70KB
|
155KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
298KB
|
981KB
|
70KB
|
125KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
|
654KB
|
1133KB
|
70KB
|
155KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance by original terminal structure
|
169KB
|
869KB
|
65KB
|
119KB
|
|
|
|
Serial
Soft |
Serial Design
Soft Termination |
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
186KB
|
946KB
|
70KB
|
155KB
|
|
|
|
Glue
|
Conductive Epoxy Application
|
AgPdCu termination reduces risk of silver migration
|
557KB
|
1097KB
|
70KB
|
155KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
157KB
|
982KB
|
69KB
|
155KB
|
|
|
|
ESD
|
ESD Protection
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
170KB
|
973KB
|
70KB
|
155KB
|
|
Commercial Grade
| Produktbild | Merkmale | Merkmale | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
1644KB
|
1158KB
|
70KB
|
155KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
1194KB
|
70KB
|
|
||
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
301KB
|
893KB
|
70KB
|
|
|
 |
LowT
|
Low Profile
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
1265KB
|
64KB
|
119KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
643KB
|
1029KB
|
70KB
|
155KB
|
|
|
Operating temperature range: Up to 150ºC
Voltage derating |
890KB
|
|
||||||
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
1038KB
|
65KB
|
119KB
|
|
 |
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
186KB
|
950KB
|
70KB
|
125KB
|
|
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
899KB
|
|
||||||
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
659KB
|
981KB
|
70KB
|
155KB
|
|
|
Resin relieves mechanical stress
(1k to 3kVdc) |
875KB
|
|
||||||
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance by original terminal structure
|
165KB
|
1490KB
|
65KB
|
119KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
905KB
|
64KB
|
|
|
 |
ULI
|
Low ESL
Ultra Low Inductance |
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
197KB
|
889KB
|
69KB
|
155KB
|
|
| Produktbild | Merkmale | Merkmale | Beschreibung | Produkt-Katalog | Spezifikation | RoHS-Zertifikat | REACH-Zertifikat | Bestell-nummern-Übersicht |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
1644KB
|
1158KB
|
70KB
|
155KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
1194KB
|
1158KB
|
70KB
|
155KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
301KB
|
893KB
|
70KB
|
155KB
|
|
|
|
LowT
|
Low Profile
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
1265KB
|
64KB
|
119KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
643KB
|
1029KB
|
70KB
|
155KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
Voltage derating |
643KB
|
890KB
|
70KB
|
155KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
1038KB
|
65KB
|
119KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
186KB
|
950KB
|
70KB
|
125KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(X7x type) |
186KB
|
899KB
|
70KB
|
125KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
659KB
|
981KB
|
70KB
|
155KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(1k to 3kVdc) |
659KB
|
875KB
|
70KB
|
155KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance by original terminal structure
|
165KB
|
1490KB
|
65KB
|
119KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
905KB
|
64KB
|
119KB
|
|
|
|
ULI
|
Low ESL
Ultra Low Inductance |
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
197KB
|
889KB
|
69KB
|
155KB
|
|