FAQ
Q.
Terminal Adhesion (5): What should I do to ensure good terminal adhesion?
  • Kondensatoren
    • >
  • Keramik-Vielschichtkondensatoren (MLCC)


A. By far the most common problem associated with poor terminal adhesion is too small of a solder fillet. Properly sized stencil apertures and a printing process free of "blinding" are crucial. Avoiding too fast of a solder profile will help ensure good solder flow and provide proper solder coverage.

Contaminated solder lands could effect the adhesion between the solder fillet and the PCB. Only clean PCBs (free of oils, moisture-free, etc.) should be used to ensure good terminal adhesion.


>>Multilayer Ceramic Chip Capacitors Product site

For any other product-related questions or inquiries, please contact us throughone of our sales representatives or this website.

All related FAQ
Q.
Terminal Adhesion (1): What can cause MLCC (Multilayer Ceramic Chip Capacitor) to come off the printed circuit board (PCB) after soldering?
  • Keramik-Vielschichtkondensatoren (MLCC)
Q.
Terminal Adhesion (2): What is “terminal adhesion” of MLCCs (Multilayer Ceramic Chip Capacitors)?
  • Keramik-Vielschichtkondensatoren (MLCC)
Q.
Terminal Adhesion (3): What is the proper amount of solder when using an MLCC (Multilayer Ceramic Capacitor)?
  • Keramik-Vielschichtkondensatoren (MLCC)
Q.
Terminal Adhesion (4): What MLCC (Multilayer Ceramic Capacitor) variables effect terminal adhesion?
  • Keramik-Vielschichtkondensatoren (MLCC)