- Kondensatoren >
- Keramik-Vielschichtkondensatoren (MLCC)
By far the most common problem associated with poor terminal adhesion is too small of a solder fillet. Properly sized stencil apertures and a printing process free of "blinding" are crucial. Avoiding too fast of a solder profile will help ensure good solder flow and provide proper solder coverage.
Contaminated solder lands could effect the adhesion between the solder fillet and the PCB. Only clean PCBs (free of oils, moisture-free, etc.) should be used to ensure good terminal adhesion.
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