Chip NTC Thermistors (Sensor)
NTCG164LH473JTDS
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Resistance [at 25°C] |
|
| Resistance Tolerance |
|
| B value (Typ.) [25/50°C] |
|
| B value (Typ.) [25/85°C] |
|
| B value (Typ.) [25/100°C] |
|
| B value Tolerance |
|
Max. Electric Power [at 25°C]
|
|
|
Permissive Operating Current [at 25°C]
|
|
|
Thermal Dissipation Constant [at 25°C]
|
|
Other
| Max. Operating Temperature |
|
| Soldering Method |
|
| UL File No. |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| Weight |
|
Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
-
SnapMagic
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C1005C0G1H470J050BA
Capacitance=47pF
Edc=50V
T.C.=C0G
LxWxT:1x0.5x0.5mm
General
Multilayer Ceramic Chip Capacitors
C2012X5R1E226M125AC
Capacitance=22μF
Edc=25V
T.C.=X5R
LxWxT:2x1.25x1.25mm
General
Multilayer Ceramic Chip Capacitors
C3216X5R1V226M160AC
Capacitance=22μF
Edc=35V
T.C.=X5R
LxWxT:3.2x1.6x1.6mm
General
Multilayer Ceramic Chip Capacitors
CGA5L2C0G1H104J160AD
Capacitance=0.1μF
Edc=50V
T.C.=C0G
LxWxT:3.2x1.6x1.6mm
Conductive Epoxy
AEC-Q200
Capacitors for Snubbering, Resonant Circuits, Power Factor Correction (PFC)
B32642B6393J000
0.039uF, 630V DC
6mm(W) x 11mm(H) x 18mm(L)
Capacitors for Snubbering, Resonant Circuits, Power Factor Correction (PFC)
B32642B6393J189
0.039uF, 630V DC
6mm(W) x 11mm(H) x 18mm(L)
Capacitors for Snubbering, Resonant Circuits, Power Factor Correction (PFC)
B32642B6393J289
0.039uF, 630V DC
6mm(W) x 11mm(H) x 18mm(L)
SMD / SMT Inductors (Coils)
MLZ2012N100LT000
L=10μH
Rated current=110mA
L x W x T :
2 x 1.25 x 1.25mm
SMD / SMT Inductors (Coils)
NLV32T-2R7J-EF
L=2.7μH
Q=30
L x W x T :
3.2 x 2.5 x 2.2mm
SMD / SMT Inductors (Coils)
SPM3012T-1R5M-LR
L=1.5μH
Rated current=2.9A
L x W x T :
3.2 x 3 x 1.2mm
