Substrates

TDK’s smart aluminum nitride (AlN) multilayer substrates and packages are shifting the boundaries of high-power devices in terms of power density, heat dissipation, reliability, and most compact footprints.
The main characteristics of aluminum nitride are highest thermal conductivity compared to other ceramics and substrate materials and excellent thermal expansion coefficient which matches with silicon (Si), silicon carbide (SiC) and gallium nitride (GaN).
SESUB (Semiconductor Embedded in SUBstrate) is the TDK’s original product. This substrate with the thinned IC can be mounted with various electronic components. SESUB enables the micro-modularization of functional circuitry such as high-performance PMUs for smartphones as well as Bluetooth modules.