FA Systems

Product Lineup

FOUP Load Port
Flip Chip Bonding System
Tech Notes
TDK Product Features
The level of cleanliness required for manufacturing processes such as semiconductor facilities and flip chip mounters is ever rising. TDK obtained the particle score which was the world's best ever recorded level in a PWP test. We manufacture and sell the next generation mini-environment systems equipped with the FOUP load port compatible with every company's 300-mm FOUP with no adjustment, enabled by the air cushion system, as well as with an automatic nitrogen purge. In addition, we manufacture and sell flip chip mounting systems which are highly reliable, space saving, and economically priced. TDK, the supplier of electronic components, brings these systems to you after thoroughly evaluating the needs at production sites from the user's perspective.