Since the advent of large language models (LLMs), artificial intelligence (AI) has been utilized in various scenarios, making AI a familiar presence.
The infrastructure technology supporting this AI utilization is a hardware system capable of advanced and large-scale parallel computation, known as AI accelerators. Currently, many AI accelerators are installed in data centers, but the server/storage/network systems traditionally used in data centers are not designed specifically for the operation of AI accelerators.
Therefore, to install AI accelerators in data centers and provide services that meet the demand for AI, many technical challenges need to be addressed. Among these, cooling of the equipment is considered the most critical issue, and the development of next-generation cooling methods for AI accelerator systems is underway. Among these, immersion cooling systems are said to be the most promising technology due to their significant cooling effects.
This article introduces our company's efforts regarding passive component products for AI accelerator systems using this immersion cooling method.

The development of next-generation vehicles for fully automated driving is gaining momentum, and the architecture of in-vehicle networks is beginning to undergo major changes.
In-vehicle Ethernet is attracting attention in automotive networks, and interfaces such as 100BASE-T1 (100Mbps) and 1000BASE-T1 (1Gbps), whose specifications are defined by the OPEN Alliance, are becoming popular. Recently, a new 10BASE-T1S (10 Mbps) has been added to this in-vehicle Ethernet, attracting a great deal of attention because of its ability to provide multi-drop connections.
This article introduces common-mode chokes and chip varistors that comply with OPEN Alliance specifications at the right time.

The advancement of digital technologies, such as the integration of AI capabilities and the enhancement of display and camera resolutions, has led to a continuous increase in the volume of data handled by digital devices like laptops and smartphones. This has driven the need for faster and higher-capacity signal transmission. However, the noise generated by these devices is also shifting to higher frequencies, necessitating countermeasures to mitigate interference with other devices and prevent signal degradation.

The TCM06U series, a compact common mode filter, is introduced as an optimal solution for noise suppression in high-speed differential signaling.

TDK has recently expanded its lineup of 3-terminal feedthrough filters, known as the "YFF Series."
With advancements in automotive electronic systems aimed at enhancing safety, comfort, and infotainment capabilities, there is an increasing demand for measures to prevent system malfunctions.
To suppress voltage variation and high-frequency noise, which can cause such malfunctions, numerous capacitors are typically employed. However, the trend toward miniaturization of these systems raises concerns about mounting space limitations due to the increased number of components.
To address these challenges, 3-terminal feedthrough filters, characterized by low ESL (Equivalent Series Inductance), are gaining significant demand. Their high noise suppression effectiveness is expected to reduce the number of components and improve performance characteristics.

PFAS, known as “forever chemicals,” pose significant environmental and health challenges due to their persistence in ecosystems and resistance to conventional treatment methods.
At SUIKI, we are pioneering the development of innovative solutions to address these challenges, starting with our prototype, Aquahive.

This article highlights the urgent need for PFAS destruction, the advantages of electrochemical oxidation (ECO), and the promising capabilities of our prototype.

With the increasing adoption of renewable energy and the proliferation of EV fast-charging stations, the demand for high-power power supplies is growing.
Transformers used in these power supplies are expected to be more compact, efficient, and generate less heat. Ferrite materials are integral to transformer products. However, core losses (iron losses) in ferrite cores can vary significantly depending on the core size, operating frequency, and load. Therefore, selecting the optimal ferrite material is a crucial aspect of transformer design.
This article introduces the features of the PEL95 material, developed specifically for high-power applications, and key considerations for its use.

With the increasing adoption of renewable energy and EV fast-charging stations, the demand for high-power power supplies is growing. Transformers used in power supplies are expected to be smaller, more efficient, and generate less heat. Ferrite materials are used in transformer products, but the core loss (iron loss) can vary significantly depending on the size of the ferrite core, the operating frequency, and the load. Therefore, selecting the optimal ferrite material is a key point in transformer design. This article introduces the features of the PEL95 material, developed specifically for high-power applications, and key considerations for its use.

Die TDK Corporation präsentiert mit der EPCOS Serie EP9 (Bestellnummer: B82804E) Übertrager für die Oberflächenmontage, die noch kompakter sind als die bestehende Serie E10EM. Ausgelegt wurden die neuen Bauelemente speziell für IGBT- und FET-Gate-Treiber-Schaltungen in anspruchsvollen Elektromobilitäts- und Industrie-Anwendungen mit einer Systemspannung von 500 V. Die Übertrager überzeugen durch eine hervorragende Isolierung, minimale Koppelkapazität und hohe thermische Belastbarkeit. Mit dieser neuen Serie ebnet TDK den Weg in eine zunehmend elektrifizierte und nachhaltige Zukunft und treibt so die grüne Transformation voran.

Grundlage der EP9 Serie ist ein MnZn-Ferritkern mit SMD-L-Pin-Konstruktion, der eine Höhe von nur 11 mm und eine Grundfläche von 13 x 11 mm² aufweist. Die Übertrager arbeiten in einem breiten Temperaturbereich von -40 °C bis +150 °C und gewährleisten eine lange Lebensdauer unter widrigen Bedingungen. Mit einer Koppelkapazität von nur 2 pF, die dem Standard AEC-Q200 Rev. E entspricht, und einer Kriech- und Luftstrecke von mindestens 5 mm werden diese oberflächenmontierbaren Bauelemente in der Regel in Automobil-Anwendungen und anderen anspruchsvollen Umgebungen eingesetzt.

Die Übertrager unterstützen mit optimierten Übersetzungsverhältnissen sowohl Halbbrücken- als auch Gegentaktwandler (Push-Pull) mit einer typischen Schaltfrequenz von 100 bis 400 kHz. Diese Bauelemente sind auf Rollen erhältlich, um eine einfache Montage in Produktionsumgebungen mit hohen Stückzahlen zu gewährleisten.

Unter der Bestellnummer B82804X1 ist ein Musterkit ist erhältlich, das sechs Übertrager jeder Version enthält.

AI and edge applications are becoming more sophisticated, requiring enhanced computational capabilities and stricter power supply demands for processors, ASICs, and FPGA/SoCs. These devices must operate efficiently in limited space while maintaining high performance. Vertical power supply overcomes the space efficiency and thermal management limitations of traditional discrete base power delivery system. This article explores the advantages and applications of vertical power supply, focusing on TDK's μPOL, and how it addresses power supply challenges in next-generation AI and edge applications.

Die TDK Corporation stellt die X1-Kondensatoren der EPCOS-Serie B3291xH/J4 vor, die elektromagnetische Störungen (EMI) in anspruchsvollen Automobil- und Industrieanwendungen mit bis zu 480 V Wechselspannung filtern. Von der hohen Feuchtigkeitsbeständigkeit der Kondensatoren profitieren unter anderem PV-Wechselrichter und Onboard-Ladegeräte (OBCs) für Elektrofahrzeuge. Diese Anwendungen müssen oft bei hohen oder niedrigen Temperaturen und hoher Luftfeuchtigkeit funktionieren. Mit einer Belastbarkeit von 1000 V (DC) sind diese Kondensatoren für die EMV von Elektrofahrzeug-Plattformen eine gute Wahl.

Die X1-Kondensatoren bestehen den THB-Test (Temperatur, Feuchtigkeit, Vorspannung) bei +85 °C, 85% relativer Luftfeuchtigkeit und 1000 Stunden bei 380 V (AC) und 1000 V (DC). Sie sind für den Betrieb bei Temperaturen bis +110 °C ausgelegt.

Ausgestattet mit selbstheilenden Eigenschaften, bietet die Serie Kapazitäten von 15 nF bis 10,0 µF und Abmessungen von 18,0 x 10,5 x 5,0 mm bis 57,5 x 57 x 45 mm. Das Anschlussraster variiert je nach Kapazität zwischen 15 mm und 52,5 mm. Die größten Modelle besitzen vier Kontaktstifte für eine erhöhte Stabilität auf der Leiterplatte. Zertifiziert sind alle Produkte nach ENEC, UL und CSA.