MLCC with Dipped Radial Lead
FA22X7R1H335KNU00
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Lead Gap(F) |
|
| Lead Diameter(d) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Withstanding Voltage |
|
Temperature Characteristic
|
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Soldering Method |
|
| Lead Length / Package Type |
|
| AEC-Q200 |
|
| Package Quantity |
|
Tech Info
Documents
Technical Support Tools
3rd Party ECAD models
-
SnapMagic
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
CGA6P4C0G2J333J250AA
Capacitance=33nF
Edc=630V
T.C.=C0G
LxWxT:3.2x2.5x2.5mm
Mid Volt. (100 to 630V)
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6P4C0G2J333J250AE
Capacitance=33nF
Edc=630V
T.C.=C0G
LxWxT:3.2x2.5x2.5mm
Soft termination
AEC-Q200
MLCC with Dipped Radial Lead
FG22X7R1H335KNT00
Capacitance=3.3μF
Edc=50V
T.C.=X7R
LxWxT:7.5x8.5x4.5mm, Lead pitch:5mm
General
Chip Beads
MMZ2012Y202BTD25
|Z|=2000Ω at 100MHz
Rated current=400mA
L x W x T :
2mm x 1.25mm x 0.85mm
