MLCC with Dipped Radial Lead
Tech Notes
TDK Product Features

High capacitance has been achieved through improvements in the thinning process of ceramic dielectric layers and multi-layer lamination technology with low residual inductance and favorable frequency response characteristics.High reliability is maintained under specified environmental conditions. Furthermore, the leads are formed with a "kink" to achieve consistent insertion heights and facilitate the release of gases during soldering for dramatically improved solderability.Taping specifications are also available for automatic insertions, which contribute to reducing on-board costs.