Chip Beads
MMZ0603S800HTD25
|
|
Size
Length(L) |
|
Width(W) |
|
Thickness(T) |
|
Recommended Land Pattern (A) |
|
Recommended Land Pattern (B) |
|
Recommended Land Pattern (C) |
|
Electrical Characteristics
Impedance at 100MHz |
|
Rated Current |
|
DC Resistance (Max.) |
|
Other
Operating Temp. Range (Including Self-Temp. Rise) |
|
Soldering Method |
|
AEC-Q200 |
|
Packing |
|
Package Quantity |
|
Weight |
|
Tech Info
Technical Support Tools
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
Loading... This process may take a while...
Customer who viewed this product also viewed

Multilayer Ceramic Chip Capacitors
CGA1A2C0G1E470J030BA
Capacitance=47pF
Edc=25V
T.C.=C0G
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200

Multilayer Ceramic Chip Capacitors
CGA1A2X7R1C472K030BA
Capacitance=4.7nF
Edc=16V
T.C.=X7R
LxWxT:0.6x0.3x0.3mm
General
AEC-Q200

Multilayer Ceramic Chip Capacitors
CGA2B2C0G2A471J050BA
Capacitance=470pF
Edc=100V
T.C.=C0G
LxWxT:1x0.5x0.5mm
Mid Volt. (100 to 630V)
AEC-Q200

Multilayer Ceramic Chip Capacitors
CGA4J1X7T0J226M125AC
Capacitance=22μF
Edc=6.3V
T.C.=X7T
LxWxT:2x1.25x1.25mm
General
AEC-Q200

Multilayer Ceramic Chip Capacitors
CGA4J4C0G2W472J125AA
Capacitance=4.7nF
Edc=450V
T.C.=C0G
LxWxT:2x1.25x1.25mm
Mid Volt. (100 to 630V)
AEC-Q200

Multilayer Ceramic Chip Capacitors
CGA5L1X7S1A226M160AC
Capacitance=22μF
Edc=10V
T.C.=X7S
LxWxT:3.2x1.6x1.6mm
General
AEC-Q200

Multilayer Ceramic Chip Capacitors
CNA5L1X7S1A226M160AE
Capacitance=22μF
Edc=10V
T.C.=X7S
LxWxT:3.2x1.6x1.6mm
Soft termination
AEC-Q200

SMD / SMT Inductors (Coils)
VLS3015CX-330M-H
L=33μH
Rated current=0.35A
L x W x T :
3 x 3 x 1.5mm

Chip Beads
MMZ0603S102HTD25
|Z|=1000Ω at 100MHz
Rated current=200mA
L x W x T :
0.6mm x 0.3mm x 0.3mm

Chip Beads
MMZ0603S800CTD25
|Z|=80Ω at 100MHz
Rated current=200mA
L x W x T :
0.6mm x 0.3mm x 0.3mm