Chip Beads
MPZ2012S601AT000
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Recommended Land Pattern (A) |
|
| Recommended Land Pattern (B) |
|
| Recommended Land Pattern (C) |
|
Electrical Characteristics
| Impedance at 100MHz |
|
| Rated Current |
|
| DC Resistance (Max.) |
|
Other
| Operating Temp. Range (Including Self-Temp. Rise) |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| Weight |
|
| FIT (Failure In Time) |
|
This will be displayed when you 
Tech Info
Technical Support Tools
3rd Party ECAD models
-
SnapMagic
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
CGA3E1X7R1E224K080AC
Capacitance=0.22μF
Edc=25V
T.C.=X7R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA3E3X5R1A225K080AB
Capacitance=2.2μF
Edc=10V
T.C.=X5R
LxWxT:1.6x0.8x0.8mm
General
AEC-Q200
Multilayer Ceramic Chip Capacitors
CGA6M3X7R1H225K200AB
Capacitance=2.2μF
Edc=50V
T.C.=X7R
LxWxT:3.2x2.5x2mm
General
AEC-Q200
EMI Suppression Capacitors
B32924A4155M000
1.5uF, 350Vrms AC
18m(W) x 27.5m(H) x 31.5m(L)
Capacitors for Snubbering, Resonant Circuits, Power Factor Correction (PFC)
B32672P6224J000
0.22uF, 630V DC
6mm(W) x 11mm(H) x 18mm(L)
SMD / SMT Inductors (Coils)
MLG1608SR33JTD25
L=330nH
Q=10
L x W x T :
1.6 x 0.8 x 0.8mm
SMD / SMT Inductors (Coils)
VLS201612HBX-R47M
L=0.47μH
Rated current=4.35A
L x W x T :
2 x 1.6 x 1.2mm
High Current Flat Wire Inductors
B82559A5602A033
L=6.0μH
Rated current=50A
L x W x H :
33 x 33 x 15mm
Chip Beads
MMZ1608S601ATA00
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
1.6mm x 0.8mm x 0.8mm
Chip Beads
MMZ2012S601AT000
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
2mm x 1.25mm x 0.85mm
