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Jan. 7, 2022
HDD Heads: TDK reports successfully shipped prototype HDD-Heads with next generation recording technology, MAS-MAMR.
Jan. 6, 2022
MEMS Microphones: TDK introduces the newest MEMS microphone with SoundWire™ functionality
Jan. 6, 2022
MEMS Sensors: TDK introduces two new high-performance ultrasonic ToF sensors
Jan. 6, 2022
MEMS Sensors: TDK expands SmartSound™ family of performance MEMS microphones at 2022 Consumer Electronics Show
Jan. 6, 2022
MEMS Sensors: TDK launches SmartMotionTM ultra-high-performance family with world's first BalancedGyroTM technology and lowest power consumption for consumer applications
Products News
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Jan. 7, 2022
Application Guide for AVAS has been released.
Dec. 27, 2021
Application Guide for Drive Recorder has been released.
Dec. 23, 2021
Solution Guide "MLCC Solutions for Power Supply Circuits (Verification of Optimal Structures for Output Capacitors)" has been released.
Dec. 22, 2021
Application Note "PCB Layout for ESD Countermeasures | ESD Visualization" has been released.
Dec. 8, 2021
Application Guide for Smart Energy has been released.
Technical Support
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Dec. 11, 2021
“TDK Transformer Design” has been updated.
Jun. 10, 2021
Notice of Revision of EMC Testing Service Use Charges
Jun. 5, 2021
PoC(Power over Coax) Selection Tool has been released.
Jun. 5, 2021
Chip NTC Thermistor Simulation has been upgraded.
Mar. 18, 2021
TDK Virtual Component Library (S-parameter, Equivalent Circuit Model, SPICE Model) updated.
Environment
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Nov. 29, 2018
"Products Conforming to European Union RoHS Directive / Product Information Concerning Revised China RoHS" has been updated.
Apr. 12, 2017
“Classifications of Medical Devices” and TDK Products’ Coverage of Those Classes has been released.
Apr. 8, 2016
Chip varistors, chip protectors, and chip NTC thermistors: RoHS certificates and REACH certificates are newly released.
Jul. 1, 2014
The contents of environment certificates (REACH) were updated
Jul. 1, 2014
The contents of environment certificates (REACH) were updated
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Jan. 12, 2022
electronica China 2022
Jan. 12, 2022
APEC 2022
Jan. 11, 2022
EMC/China Shenzhen
Jan. 11, 2022
EMC 2022 & MW 2022
Jan. 11, 2022
APEMC2022
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Jul. 18, 2018
"Cookie Policy" has been released.
Feb. 14, 2018
Report on the DOJO Cultural Festival 2017
Mar. 12, 2017
Release of "myTDK", our membership-based service
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Selection Guides
Selection guides for TDK group products (TDK, EPCOS, TDK-Lambda).
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Jan. 7, 2022
Press Release
HDD Heads: TDK reports successfully shipped prototype HDD-Heads with next generation recording technology, MAS-MAMR.
Jan. 7, 2022
Product News
Application Guide for AVAS has been released.
Jan. 6, 2022
Press Release
MEMS Microphones: TDK introduces the newest MEMS microphone with SoundWire™ functionality
Jan. 6, 2022
Press Release
MEMS Sensors: TDK introduces two new high-performance ultrasonic ToF sensors
Jan. 6, 2022
Press Release
MEMS Sensors: TDK expands SmartSound™ family of performance MEMS microphones at 2022 Consumer Electronics Show
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6.4-j1se | 50se
30se | 50se
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50se | 34+j10bal
50se | 34+j60bal
50se | 34+j72bal
50se | 36+j48.8bal
50se | 40+j35bal
50se | 44+j73bal
50se | 50bal
50se | 50+j40bal
50se | 50-j100bal
50se | 55+j50bal
50se | 89+j43bal
50se | 100bal
50se | 200bal
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