Fast Response NTC Thermistor: Revolutionizing Thermal Management by Balancing Thermal Conductivity with a compact package in a thin substrate integrated structure

This product is a compact NTC thermistor with lead wires and a high-thermal-conductive thin substrate integrally molded onto the heat-receiving surface. Its primary feature is the minimization of the heat transfer path through a 'caseless structure.' By eliminating the casing materials and potting resins used in conventional case-type NTC thermistors, we have minimized the thermal resistance from the heat source to the element. This results in fast response superior to conventional NTC thermistors. The thin design enables mounting in tight spaces where installation was not possible.

By optimizing the heat conduction path of NTC thermistors, we have achieved a dramatic improvement in high-speed response and a low profile for installation in confined spaces. The integration of the sensing substrate and the element minimizes thermal conduction, allowing heat to be transmitted directly to the element. By reducing the sensor's thermal capacity, sudden temperature changes can be detected. We have shortened the thermal time constant by selecting the optimal substrate according to the application and cost.

In conventional case-type NTC thermistors, the presence of a case or potting resin between the sensor element and the heat source creates thermal resistance, causing slow response time. This product is designed to optimize thermal conductivity by replacing traditional resin parts with metal. It is engineered for mechanical fastening using lug terminals or clips which ensures stable thermal coupling maintained in high-vibration environments.

• Measuring responsiveness by transferring the NTC thermistor from room temperature (25°C) to a heated source (90°C)

Leveraging its narrow body and high-speed responsiveness, this product can be utilized in scenarios requiring advanced thermal management, such as:
・Fast Charging Power Line Monitoring: Provides high-speed feedback (at 1-second intervals) essential for real-time control against localized heat generation.
・Thermal Management for High-Density Equipment: Achieves pinpoint detection in tight spaces where conventional NTC thermistors do not fit, such as gaps between circuit boards.
・Compatibility with Diverse Surface Shapes: Mounting methods can be selected to match the shape of the object, such as flat or cylindrical surfaces, ensuring stable, long-term temperature monitoring.

As this product is currently in the development phase, we offer customization to meet your specific design requirements. Evaluation samples—custom for your application's substrate shape, resistance value, and mounting configuration—can be provided with a lead time of approximately 3 weeks.

【Information Requested for Inquiries】 
We also provide technical consultations and contract evaluation services. To ensure a smooth response, please include the following details in your inquiry:
・Desired response speed (thermal time constant) and measurement temperature range.
・Details of the mounting object and fixation method (e.g., flat surface, pipe diameter, etc.).
・Desired lead wire length.
・Estimated mass production timing and volume.

Request Evaluation Samples Here