Tech Library

The development of next-generation vehicles for fully automated driving is gaining momentum, and the architecture of in-vehicle networks is beginning to undergo major changes.
In-vehicle Ethernet is attracting attention in automotive networks, and interfaces such as 100BASE-T1 (100Mbps) and 1000BASE-T1 (1Gbps), whose specifications are defined by the OPEN Alliance, are becoming popular. Recently, a new 10BASE-T1S (10 Mbps) has been added to this in-vehicle Ethernet, attracting a great deal of attention because of its ability to provide multi-drop connections.
This article introduces common-mode chokes and chip varistors that comply with OPEN Alliance specifications at the right time.

The advancement of digital technologies, such as the integration of AI capabilities and the enhancement of display and camera resolutions, has led to a continuous increase in the volume of data handled by digital devices like laptops and smartphones. This has driven the need for faster and higher-capacity signal transmission. However, the noise generated by these devices is also shifting to higher frequencies, necessitating countermeasures to mitigate interference with other devices and prevent signal degradation.

The TCM06U series, a compact common mode filter, is introduced as an optimal solution for noise suppression in high-speed differential signaling.

TDK has recently expanded its lineup of 3-terminal feedthrough filters, known as the "YFF Series."
With advancements in automotive electronic systems aimed at enhancing safety, comfort, and infotainment capabilities, there is an increasing demand for measures to prevent system malfunctions.
To suppress voltage variation and high-frequency noise, which can cause such malfunctions, numerous capacitors are typically employed. However, the trend toward miniaturization of these systems raises concerns about mounting space limitations due to the increased number of components.
To address these challenges, 3-terminal feedthrough filters, characterized by low ESL (Equivalent Series Inductance), are gaining significant demand. Their high noise suppression effectiveness is expected to reduce the number of components and improve performance characteristics.

PFAS, known as “forever chemicals,” pose significant environmental and health challenges due to their persistence in ecosystems and resistance to conventional treatment methods.
At SUIKI, we are pioneering the development of innovative solutions to address these challenges, starting with our prototype, Aquahive.

This article highlights the urgent need for PFAS destruction, the advantages of electrochemical oxidation (ECO), and the promising capabilities of our prototype.

With the increasing adoption of renewable energy and the proliferation of EV fast-charging stations, the demand for high-power power supplies is growing.
Transformers used in these power supplies are expected to be more compact, efficient, and generate less heat. Ferrite materials are integral to transformer products. However, core losses (iron losses) in ferrite cores can vary significantly depending on the core size, operating frequency, and load. Therefore, selecting the optimal ferrite material is a crucial aspect of transformer design.
This article introduces the features of the PEL95 material, developed specifically for high-power applications, and key considerations for its use.

With the increasing adoption of renewable energy and EV fast-charging stations, the demand for high-power power supplies is growing. Transformers used in power supplies are expected to be smaller, more efficient, and generate less heat. Ferrite materials are used in transformer products, but the core loss (iron loss) can vary significantly depending on the size of the ferrite core, the operating frequency, and the load. Therefore, selecting the optimal ferrite material is a key point in transformer design. This article introduces the features of the PEL95 material, developed specifically for high-power applications, and key considerations for its use.

AI and edge applications are becoming more sophisticated, requiring enhanced computational capabilities and stricter power supply demands for processors, ASICs, and FPGA/SoCs. These devices must operate efficiently in limited space while maintaining high performance. Vertical power supply overcomes the space efficiency and thermal management limitations of traditional discrete base power delivery system. This article explores the advantages and applications of vertical power supply, focusing on TDK's μPOL, and how it addresses power supply challenges in next-generation AI and edge applications.

As environmental awareness grows and the realization of a sustainable society becomes increasingly important, the mobility market is witnessing an active movement towards “EV adoption," aiming to transition from gasoline-powered to electric-powered motor vehicles. In order to realize higher performance electric vehicles (EVs) and electric motorcycle, next-generation electric motor technology that balances factors such as high efficiency, high reliability, compactness, light weight, and cost performance at a high level is required.
 
In this article, we make a comparison of angle sensor technologies responsible for detecting rotational angles in traction electric motor (hereafter referred to as e-motor) control and explain how our TMR angle sensors enhance your design.

On Board Chargers (OBCs) installed in electric vehicles are becoming increasingly powerful, with an output power of 22 kW. Even at higher power output levels, it is not acceptable to increase the size of the OBC itself, so compact design is required. Capacitors for the resonant circuit function are required to have high withstand voltage and low loss products that can withstand higher power densities than conventional products.
In order to meet this demand, TDK has released a new autograde C0G MLCC series with a rated voltage of 1250 V.

Through an example of the operation of a resonant capacitor in an LLC resonant converter, we will introduce why we recommend a 1250V rated C0G MLCC.

TDK, as part of its continued efforts to bring environmentally friendly technical solutions to the market, has recently developed a plating process that enables manufacturing of thick, highly precise copper patterns on thin-film substrates without using typical exposure/etching technologies. The copper deposition can be to one or both sides of the thin-film substrate to reduce the coil’s [antenna’s] DC resistance (DCR). This innovation has been achieved through an electro-plating process that uses a nano-dispersed organic polymer called polypyrrole (PPy), a material solution from Achilles Corporation and is combined with TDK’s internal process technology. TDK’s unique copper plating process employs an "additive” methodology, where copper is plated only on defined areas to form the required pattern and is in direct contrast to standard methods that etch away from a copper layer in a subtractive process. Additionally, by incorporating TDK’s proprietary high-performance magnetic shielding materials, end-product miniaturization can be realized.