In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.

NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).

Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.

This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.

In addition to explaining the characteristics of C0G MLCCs with high withstand voltage, this section focuses on the advantages of replacing the film capacitors used in EV wireless power transfer systems.

This section mainly explains the advantages of using MLCCs to replace film capacitors in the onboard chargers (OBC) of plug-in charging systems.

In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.

PCB Deflection Countermeasure, Acoustic Noise Countermeasure and Noise Countermeasures in Automotive DC Motors in MLCC with Dippled Radial Lead

TDK offers special types of MLCC products with redundancy design, in order to avoid short circuit failures and improve the reliability of equipment. Please select products that suit your purposes and use them to improve the reliability of your products.

This atricle introduces major causes and countermeasures of solder crack in MLCCs (Multilayer Ceramic Chip Capacitors).