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Solution Guides
[Solution Guide]
MLCC solution for resonant circuit Vol.1
In resonant circuits used for wireless chargers and DC-DC converters, film capacitors have traditionally been used. However, advancements in the capacity expansion and high voltage resistance of Multilayer Ceramic Capacitors (MLCCs) have made it possible to replace film capacitors with MLCCs in these applications. Switching from film capacitors to MLCCs offers benefits such as miniaturization and reduced losses.
In resonant circuits used for wireless chargers and DC-DC converters, film capacitors have traditionally been used. However, advancements in the capacity expansion and high voltage resistance of Multilayer Ceramic Capacitors (MLCCs) have made it possible to replace film capacitors with MLCCs in these applications. Switching from film capacitors to MLCCs offers benefits such as miniaturization and reduced losses.
Solution Guides
[Solution Guide]
Overview and Functions of Parts Selection Tool TDK Meister
TDK Meister is an application software for Windows®, that can search TDK electronic components and display graphs for their characteristics. Using TDK Meister, you can easily select TDK electronic components that are optimum for electronic circuit design and EMC counter measure. In this article, overview and major functions of TDK Meister are introduced.

The formal name of Windows(R) is Microsoft(R) Windows(R) Operating System.<br>Microsoft(R) and Windows(R) are registered trademarks of Microsoft Corporation in the United States and/or other countries.
TDK Meister is an application software for Windows®, that can search TDK electronic components and display graphs for their characteristics. Using TDK Meister, you can easily select TDK electronic components that are optimum for electronic circuit design and EMC counter measure. In this article, overview and major functions of TDK Meister are introduced.

The formal name of Windows(R) is Microsoft(R) Windows(R) Operating System.<br>Microsoft(R) and Windows(R) are registered trademarks of Microsoft Corporation in the United States and/or other countries.
Solution Guides
[Solution Guide]
Total Solutions for NFC Circuits
NFC stands for Near Field Communication, a type of short-range wireless communication.
Devices equipped with NFC can perform data transmission and authentication simply by being brought close to each other. This feature is rapidly being integrated into smartphones in recent times.
Additionally, its implementation is expanding to peripheral devices like wearable devices such as smartwatches.
NFC is widely used in cashless payment transactions and for connecting and authenticating peripheral devices. It holds the potential for diverse applications in realizing a touchless society.
This article introduces the main components used in NFC circuits, including NFC antennas, magnetic sheets, inductors for LC filters, and baluns for single-ended circuits.
NFC stands for Near Field Communication, a type of short-range wireless communication.
Devices equipped with NFC can perform data transmission and authentication simply by being brought close to each other. This feature is rapidly being integrated into smartphones in recent times.
Additionally, its implementation is expanding to peripheral devices like wearable devices such as smartwatches.
NFC is widely used in cashless payment transactions and for connecting and authenticating peripheral devices. It holds the potential for diverse applications in realizing a touchless society.
This article introduces the main components used in NFC circuits, including NFC antennas, magnetic sheets, inductors for LC filters, and baluns for single-ended circuits.
Solution Guides
[Solution Guide]
MLCC Solutions for Power Supply Circuits (Verification of Optimal Structures for Output Capacitors)
In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.
In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.
Solution Guides
[Solution Guide]
Soft Termination Capacitors, Inductors, and Chip Beads for High-Reliability Products for Automotive Applications
Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.
Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.
Solution Guides
[Solution Guide]
Technical Support Using PI Simulation
This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.
This is an introduction to our services for technical support which utilize PI simulations to lower the impedance in power-supply lines and reduce the quantity of required decoupling capacitors, by replacing 2-terminal MLCCs with low-ESL capacitors. We hope they will be of use to you in the increasingly severe field of impedance optimized power-supply line design, and in applications for decoupling capacitor compositions and board design techniques, which are continuing to grow in importance.
Solution Guides
[Solution Guide]
Vol.3 Application to EV wireless power transfer systems
In addition to explaining the characteristics of C0G MLCCs with high withstand voltage, this section focuses on the advantages of replacing the film capacitors used in EV wireless power transfer systems.
In addition to explaining the characteristics of C0G MLCCs with high withstand voltage, this section focuses on the advantages of replacing the film capacitors used in EV wireless power transfer systems.
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[Solution Guide]
Vol.2 Application to EV plug-in power charging systems
This section mainly explains the advantages of using MLCCs to replace film capacitors in the onboard chargers (OBC) of plug-in charging systems.
This section mainly explains the advantages of using MLCCs to replace film capacitors in the onboard chargers (OBC) of plug-in charging systems.
Solution Guides
[Solution Guide]
Vol.1 Features of High voltage MLCCs with C0G Characteristics and Replacement Solutions
In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.
In recent years, there have been remarkable increases in withstand voltage and capacitance in MLCCs (multilayer ceramic chip capacitors) for temperature compensation (type 1). In particular, even in fields where film capacitors have traditionally been used, resonance circuits for example, replacement with MLCC is now possible.
Solution Guides
[Solution Guide]
Guide on Various Solutions Offered by MLCCs with Dipped Radial Leads
PCB Deflection Countermeasure, Acoustic Noise Countermeasure and Noise Countermeasures in Automotive DC Motors in MLCC with Dippled Radial Lead
PCB Deflection Countermeasure, Acoustic Noise Countermeasure and Noise Countermeasures in Automotive DC Motors in MLCC with Dippled Radial Lead