TDK Corporation (TSE:6762) presents the B3271*H* series, new EPCOS film capacitors for DC link applications that feature high energy and power density. The capacitors are rated for voltages from 500 V DC to 1600 V DC, offer capacitance values from 0.47 µF to 170 µF and are suitable for a maximum operating temperature of up to 105 °C. At a rated voltage and operating temperature of 70 °C, the typical life of the rugged, self-healing and RoHS-compliant capacitors is 95,000 hours.

High energy, reliable and volumetric efficient inverters are essential to reducing emissions of vehicles based on 48 V technology. DC-link capacitors can significantly contribute to this target by reducing parasitic losses and increasing thermal efficiency. High inverter powers can be theoretically achieved with multiple capacitor connections. However, a high number of parallel-connected parts also increase the complexity of the system stability. In the field of Aluminum Electrolytic Capacitors, the Hybrid Polymer technology offers higher ripple current densities by a factor of, e.g., 5x compared to standard Liquid Electrolyte technology. By applying the Hybrid Polymer technology to the large axial capacitor can sizes, with solid mechanical construction and special thermal dissipation feature, a compact DC-link solution with a reduced amount of capacitor and minimized thermal escalation risk through stable and efficient thermal design can be achieved.

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types. The ripple current capability is now up to 35 A (20 kHz, 125 °C). The new types are designed for a rated voltage of 63 V, cover a capacitance range from 390 µF to 720 µF, and offer an extremely low ESR value. For example, with a cup size of 16 mm x 30 mm (D x H) and an ambient temperature of 20 °C, an ESR of 3.9 mΩ at 20 kHz can be achieved. Even at an operating temperature of -40 °C, the ESR is just 5.4 mΩ.

In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.

NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).

TDK Corporation has extended its product range of hybrid-polymer aluminum electrolytic capacitors, and now offers two series with an axial design. The B40600* / B40700* series is designed for rated voltages of 25 V and 35 V. These cover a capacitance range from 780 µF to 2200 µF. Capacitors in the 63 V voltage class, with capacitance values from 390 µF to 720 µF, are available with the B40640* / B40740* series.

The evolution of sensing technology and communication network contribute to the realization of an Autonomous driving society and its growth. Ultrasonic parking assistant is a key sensor for automated driving and parking functions. Ultrasonic parking sensors were in use in Europe long before debate on automated driving became active. TDK has for many years supplied Piezo Disks and ultrasonic driver transformers for use with ultrasonic parking sensors. TDK also developed a multilayer ceramic chip capacitor that exhibits attenuating capacitance (ZL characteristics) under high-temperature environments that is suitable for resonant circuits with Piezo Disk. This article presents Piezo Disk, ultrasonic driver transformers, and MLCC with ZL characteristics.

Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.

As the electrification of the automotive progresses, the demand for motor generators is on the rise. There is also a trend towards integration of electric motors and inverters, and the requirements with regard to compact dimensions and resistance against heat and vibrations are becoming ever more severe, while high reliability is also an important factor. In some cases, wiring inductance can lead to high surge voltages which requires countermeasures such as suitable wiring design and snubber capacitors. At the same time, noise countermeasures are also essential.

TDK Corporation has extended its range of hybrid polymer aluminum electrolytic capacitors with a new SMD series. The components are now available in 25 V DC / 330 µF and 35 V DC / 270 µF versions, each with dimensions of 10 x 10.2 mm (d x l).