Tech Library
Products & Technologies
Mar. 2022
TDK Corporation (TSE: 6762) introduces the new PCM120T series of shielded SMT power inductors, optimized for high saturation currents and low DC resistances. The PCM120T product family includes 14 inductance values between 0.4 μH and 10 μH, whereby saturation currents of up to 80 A are reached depending on the L value. Optimal saturation properties are achieved through the use of an iron alloy core. Flat wire windings are used to keep losses as low as possible. This results in low ohmic resistance values (RDC) of 0.72 mΩ (0.4 μH) to 9 mΩ (10 μH). The new inductors have an outstanding EMC performance due to closed housing made of ferrite material without an external gap. They are ideal for automatic solder joint inspection (AOI) and achieve a coplanarity of <0.1 mm due to their lead frame structure. The product’s metal cores provide resistance against high voltage pulses in accordance with ISO7636. The components’ dimensions are 12.7 x 15.8 x 11.5 mm (W x L x H). The powerful RoHS-compatible inductors are designed for a wide temperature range from -55 °C to +165 °C and are certified according to AEC-Q200.
TDK Corporation (TSE: 6762) introduces the new PCM120T series of shielded SMT power inductors, optimized for high saturation currents and low DC resistances. The PCM120T product family includes 14 inductance values between 0.4 μH and 10 μH, whereby saturation currents of up to 80 A are reached depending on the L value. Optimal saturation properties are achieved through the use of an iron alloy core. Flat wire windings are used to keep losses as low as possible. This results in low ohmic resistance values (RDC) of 0.72 mΩ (0.4 μH) to 9 mΩ (10 μH). The new inductors have an outstanding EMC performance due to closed housing made of ferrite material without an external gap. They are ideal for automatic solder joint inspection (AOI) and achieve a coplanarity of <0.1 mm due to their lead frame structure. The product’s metal cores provide resistance against high voltage pulses in accordance with ISO7636. The components’ dimensions are 12.7 x 15.8 x 11.5 mm (W x L x H). The powerful RoHS-compatible inductors are designed for a wide temperature range from -55 °C to +165 °C and are certified according to AEC-Q200.
Solution Guides
Nov. 2020
[Solution Guide]
NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).
NFC is an abbreviation of Near Field Communication; it is a type of short-range wireless communications.
NFC is a function that can perform data communications and authentication when two NFC-compatible devices are brought close together, and adoption in smart phones has been growing rapidly in recent years.
Increased use in peripheral devices including wearable terminals, such as smart watches, has also been observed.
NFC is used in many situations including cashless payment and authentication of connections with peripheral devices, and it is expected to be used for even more diverse applications as we move towards a touchless society.
This article introduces the main components used in NFC circuits: NFC antenna, magnetic sheet, LC filter inductor, single-end circuit balun, and electric double-layer capacitor (EDLC/supercapacitor).
Solution Guides
Dec. 2019
[Solution Guide]
Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.
Automakers are incorporating more multifunctional capabilities into automobiles as they seek to make autonomous driving a reality. Electronic control units (ECUs) for advanced driver assistance systems are consuming more power, and the latest trend is toward ECU integration—installing an ECU close to the engine room or other working part.
For these reasons, the number of electronic devices and components built into cars these days is on the rise, and the reliability of the electronic components used in the electronics is having a growing impact on the reliability of the vehicle overall.
Applications & Cases
Nov. 2019
[Application Note]
The evolution of sensing technology and communication network contribute to the realization of Autonomous driving society and its growth. In association with full-scale expansion of the "5G service" next-generation wireless communication standard, great attention is being placed on wireless technology intended for "vehicle-to-vehicle and infrastructure-to-vehicle communication" (V2X) to communicate data between automobiles and their surroundings. While the TDK Group can offer a lineup of various electronic components for V2X, this article introduces a selection of IMU (Inertial Measurement Unit) and high-frequency products for Telematics Control Units (TCUs).
The evolution of sensing technology and communication network contribute to the realization of Autonomous driving society and its growth. In association with full-scale expansion of the "5G service" next-generation wireless communication standard, great attention is being placed on wireless technology intended for "vehicle-to-vehicle and infrastructure-to-vehicle communication" (V2X) to communicate data between automobiles and their surroundings. While the TDK Group can offer a lineup of various electronic components for V2X, this article introduces a selection of IMU (Inertial Measurement Unit) and high-frequency products for Telematics Control Units (TCUs).