TDK Corporation (TSE: 6762) presents the AVD series of new pressure transmitters, distinguishable by their extremely low-profile design and high precision. The transmitters with B58621V* ordering codes are available in three versions for different pressure measurement ranges including 0 to 16 mbar, 0 to 100 mbar, and 0 to 7 bar.

TDK Corporation (TSE:6762) presents the new B78416A* series of compact EPCOS transformers with EP 6 cores for ultrasonic applications. The series comprises five types with transformation ratios between 1:1:8.42 and 1:1:15. Depending on the type, the new SMD-version transformers offer inductance values between 3 mH and 5 mH and are suitable for frequencies between 52 kHz and 300 kHz. The components are compliant with AEC-Q200, feature highly compact dimensions of just 9.0 x 7.6 x 7.1 mm and are magnetically shielded for better interference suppression. The permissible temperature range lies between -40 °C and +125 °C.

This guide introduces CNA series – low-resistance soft termination products, which achieves both high reliability and low resistance.

TDK Corporation (TSE: 6762) has extended its range of bipolar DC high-voltage contactors to include the new HVC43 (B88269X3**0C011) series. These products complete the existing range by offering continuous currents from 150 A DC to 250 A DC and operating voltages of up to 1000 V DC. The contactors are available in 12 V or 24 V coils with a power consumption of 6 W.

TDK Corporation (TSE: 6762) presents with the B40640B* and B40740B* series hybrid polymer capacitors with a very high ripple current capability increased by up to 29 per cent compared to preceding types. The ripple current capability is now up to 35 A (20 kHz, 125 °C). The new types are designed for a rated voltage of 63 V, cover a capacitance range from 390 µF to 720 µF, and offer an extremely low ESR value. For example, with a cup size of 16 mm x 30 mm (D x H) and an ambient temperature of 20 °C, an ESR of 3.9 mΩ at 20 kHz can be achieved. Even at an operating temperature of -40 °C, the ESR is just 5.4 mΩ.

TDK Corporation (TSE:6762) presents the new L860 NTC thermistor chip which can be directly embedded into power modules and used within sintering and AI-heavy wire bonding. Its characteristics correspond to the common MELF-R/T curve with R100 of 493 Ω. The lead-free chip with ordering code B57860L0522J500 is designed for a wide temperature range of
-55 °C to +175 °C, has dimensions of 1.6 x 1.6 x 0.5 mm.

In e-mobility, the temperature of all system units needs to be constantly monitored. The high currents result in losses with a corresponding generation of heat arising, in particular, at contacts. TDK has now developed a special-purpose high-voltage resistant temperature sensor for connectors.

TDK has developed a process in which ultrasonic waves are used to transmit data and energy with an Acoustic Data Link (ADL). These signals can even penetrate metal. In doing so, piezoelectric material components convert electrical signals into mechanical vibrations to excite acoustic waves and vice versa. This effect enables devices to be identified or sensor data to be read out, whereby the energy transmission is simultaneously possible in closed metal chambers or pipes, for example.

Various frequency converters for pumps and compressors are used in the petrochemical industry for extracting and producing oil and gas, which leads to a large load of the grid with harmonics. This problem can be solved with EPCOS PQSine®.

In the automotive field, CPUs and FPGAs for systems that require advanced image processing, such as onboard ADAS ECUs and autonomous ECUs, need to operate at high speed and require high drive current in conjunction with the increasing performance and functionality of systems. Also, in the ICT field, power supply configurations that support higher current required for devices that need huge amounts of power such as servers. There is a trend towards higher operating speeds and higher currents in the power supply lines of systems with increased performance and functions as described above. At the same time, power supply structures that maintain the nominal voltage within narrow tolerance ranges, which have decreased in conjunction with processor miniaturization, are also required.