Discontinued in the end of September 2018.
TDK components such as chip beads, inductors (coils), ceramic capacitors, 3-terminal filters, common mode filters, varistors, baluns, NTC thermistors are included.
Impedance, inductance, Q, and tanδ characteristics can be displayed.
Not only |S11| and |S21| characteristics, but also phases, group delay time, and Smith charts can be displayed.
Mixed mode S-parameters can be used to evaluate differential (balanced) components.
Arrays can be analyzed using multiple ports, which makes it easy to evaluate crosstalk.
It is possible to show the DC bias and temperature characteristics for inductors and capacitors, which are mainly used for power circuits.
It is possible to simulate both single line and differential transmissions. This makes it easy to confirm the efficiency of ferrite beads and common mode filters.
TDR is used to evaluate the characteristic impedance of high-speed differential (balanced) components.
It is possible to show the temperature rise characteristics of inductors and capacitors, which are mainly used for power circuits, for direct current and ripple current.
It is possible to simulate the high-voltage suppression effect of chip varistors.
NTC thermistors resistance changes depending on the temperature. This simulation shows the output voltage and temperature differences when the component is used in a circuit.
It is possible to create virtual components by combining various components.
This is helpful, for example, when creating a discrete filter by combining an inductor and capacitor.
This filter would be able to handle both two-port and four-port components.
This tool can calculate the characteristic impedance based on the size of the printed circuit board.
This tool can be used for both single lines and coupled lines, and for other lines such as coaxials, strips, coplanars, and microstrips.
In addition, you can create S-parameters for these lines. So, if this tool is used along with the user-defined filter, it is possible to create a layout with lines between components.