News


TDK Product Information NEWS	Vol.032　May 2019

Topics

・Selection guides for electromagnetic buzzer and piezoelectric buzzer have been released. ・Newly introduce the Dividers / Splitters portal site under RF Components and Modules ・The Product Overview of MEMS microphones is updated with new product T4081. ・Chip NTC Thermistor Simulation has been released. ・Event information

Selection guides for electromagnetic buzzer and piezoelectric buzzer have been released.

Electromagnetic Buzzer

A selection guide for our electromagnetic buzzers. Customers can use it to find the best electromagnetic buzzers for their applications according to their shape, frequency, and other characteristics, and can also listen to sound tests of buzzers in operation.

Piezoelectric Buzzer

A selection guide for our piezoelectric buzzers. Customers can use it to find the best piezoelectric buzzers for their applications according to their shape, sound pressure level, frequency, and other characteristics, and can also listen to sound tests of buzzers in operation.

Newly introduce the Dividers / Splitters portal site under RF Components and Modules

Dividers/splitters function to divide one high-frequency signal into two signals. We offer an extensive product lineup of dividers produced using low temperature co-fired ceramics (LTCC), with a wide range of frequency variations, geometries, terminal structures, specification values, and other properties.

》Products　Dividers / Splitters

The Product Overview of MEMS microphones is updated with new product T4081.

In recent years, for devices such as smartphones, MEMS microphones in which MEMS (Micro Electro Mechanical System) technology is utilized have been increasingly adopted. Further downsizing and acoustic characteristics improvement of MEMS microphone is required in electrical devices with the features of sound event detection or recording such as wearable products, action cameras, digital cameras, as well as smartphones. Also, high-performance microphone is a must in utilizing speech recognition interfaces. To respond to these needs, TDK has successfully achieved further downsizing/low profiling/high performance, based on the CSMP (Chip Size MEMS Packaging) technology cultivated thorough the development of SAW device, etc.

》Product Overview MEMS Microphone T4064/T4081

Chip NTC Thermistor Simulation has been released.

When you select the product type (brand, chip size, application), some representative product lists are displayed. After that, enter the conditions (Vin, Vout, temperature range) and click the simulation button to determine whether the conditions are satisfied.

》Chip NTC Thermistor Simulation

Event information

Throughout 2019, ICsense will host 3 webinars to provide useful insights in how and when to use ASICs (Application Specific ICs) for automotive, medical, industrial and consumer projects. Sharpen your knowledge on electronics integration and learn if it is useful for your company as well.

》ICsense Webinar series 2019