Multilayer Ceramic Chip Capacitors
C1608X8R1C334K080AE
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Size
| Length(L) |
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| Width(W) |
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| Thickness(T) |
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| Terminal Width(B) |
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| Terminal Spacing(G) |
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| Recommended Land Pattern (PA) |
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| Recommended Land Pattern (PB) |
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| Recommended Land Pattern (PC) |
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Electrical Characteristics
| Capacitance |
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| Rated Voltage |
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| Temperature Characteristic |
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| Dissipation Factor (Max.) |
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| Insulation Resistance (Min.) |
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Other
| Operating Temp. Range |
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| Soldering Method |
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| AEC-Q200 |
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| Packing |
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| Package Quantity |
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Tech Info
Documents
Technical Support Tools
Characteristic Graph
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Multilayer Ceramic Chip Capacitors
C1608X5R0G226M080AA
Capacitance=22μF
Edc=4V
T.C.=X5R
LxWxT:1.6x0.8x0.8mm
General
Multilayer Ceramic Chip Capacitors
CGBDT1X6S0G105M022BC
Capacitance=1μF
Edc=4V
T.C.=X6S
LxWxT:0.52x1xmm
Low ESL reverse geometry
Chip Beads
MMZ1608B121CTDH5
|Z|=120Ω at 100MHz
Rated current=600mA
L x W x T :
1.6mm x 0.8mm x 0.6mm