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Part No. Lists
General
General
(Up to 75Vdc)
Rated voltage: Up to 75Vdc
897KB
1200KB
65KB
241KB
Mid
Mid Voltage
(100 to 630Vdc)
Rated voltage: 100 to 630Vdc
683KB
65KB
High
High Voltage
(1k to 3kVdc)
Rated voltage: 1k to 3kVdc
250KB
1083KB
65KB
150°C
High Temperature Application
Operating temperature range: Up to 150ºC
584KB
1200KB
65KB
Mega
MEGACAP
(with metal frame)
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure
293KB
980KB
65KB
Soft
Soft Termination
Resin relieves mechanical stress
649KB
1132KB
65KB
Soft
LowR
Soft Termination
Low Resistance
Integration of both high reliability and low resistance
169KB
873KB
65KB
Serial
Soft
Serial Design
Soft Termination
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress
182KB
946KB
65KB
Glue
Conductive Epoxy Application
AgPdCu termination reduces risk of silver migration
552KB
969KB
65KB
L↔W
Low ESL
Reverse Geometry
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs
153KB
982KB
64KB
ESD
ESD Protection
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
165KB
973KB
65KB
Product Image
Features
Features
Description
Product Catalog
Specification
RoHS Certificate
REACH Certificate
Part No. Lists
General
General
(Up to 75Vdc)
Rated voltage: Up to 75Vdc
897KB
1200KB
65KB
241KB
Mid
Mid Voltage
(100 to 630Vdc)
Rated voltage: 100 to 630Vdc
683KB
1200KB
65KB
241KB
High
High Voltage
(1k to 3kVdc)
Rated voltage: 1k to 3kVdc
250KB
1083KB
65KB
241KB
150°C
High Temperature Application
Operating temperature range: Up to 150ºC
584KB
1200KB
65KB
241KB
Mega
MEGACAP
(with metal frame)
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure
293KB
980KB
65KB
241KB
Soft
Soft Termination
Resin relieves mechanical stress
649KB
1132KB
65KB
241KB
Soft
LowR
Soft Termination
Low Resistance
Integration of both high reliability and low resistance
169KB
873KB
65KB
241KB
Serial
Soft
Serial Design
Soft Termination
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress
182KB
946KB
65KB
241KB
Glue
Conductive Epoxy Application
AgPdCu termination reduces risk of silver migration
552KB
969KB
65KB
241KB
L↔W
Low ESL
Reverse Geometry
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs
153KB
982KB
64KB
241KB
ESD
ESD Protection
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
165KB
973KB
65KB
241KB
Commercial Grade
Product Image
Features
Features
Description
Product Catalog
Specification
RoHS Certificate
REACH Certificate
Part No. Lists
General
General
(Up to 75Vdc)
Rated voltage: Up to 75Vdc
1626KB
1158KB
65KB
241KB
Mid
Mid Voltage
(100 to 630Vdc)
Rated voltage: 100 to 630Vdc
778KB
65KB
High
High Voltage
(1k to 3kVdc)
Rated voltage: 1k to 3kVdc
296KB
892KB
65KB
LowT
Low Profile
Product height is lower than that of general products, and the available maximum height is from 0.22mm
137KB
1265KB
64KB
150°C
High Temperature Application
Operating temperature range: Up to 150ºC
639KB
1030KB
65KB
Operating temperature range: Up to 150ºC
Voltage derating
889KB
Mega
MEGACAP
(with metal frame)
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure
300KB
1038KB
65KB
Mega I
LowR
MEGACAP
(Low Resistance, Inline)
Integration of high capacitance, high reliability and low resistance
(C0G type)
181KB
1027KB
65KB
Integration of high capacitance, high reliability and low resistance
(X7x type)
898KB
Soft
Soft Termination
Resin relieves mechanical stress
(Up to 630Vdc)
656KB
983KB
65KB
Resin relieves mechanical stress
(1k to 3kVdc)
918KB
Soft
LowR
Soft Termination
Low Resistance
Integration of both high reliability and low resistance
165KB
1490KB
65KB
L↔W
Low ESL
Reverse Geometry
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs
167KB
905KB
64KB
ULI
Low ESL
Ultra Low Inductance
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs
144KB
889KB
64KB
Product Image
Features
Features
Description
Product Catalog
Specification
RoHS Certificate
REACH Certificate
Part No. Lists
General
General
(Up to 75Vdc)
Rated voltage: Up to 75Vdc
1626KB
1158KB
65KB
241KB
Mid
Mid Voltage
(100 to 630Vdc)
Rated voltage: 100 to 630Vdc
778KB
1158KB
65KB
241KB
High
High Voltage
(1k to 3kVdc)
Rated voltage: 1k to 3kVdc
296KB
892KB
65KB
241KB
LowT
Low Profile
Product height is lower than that of general products, and the available maximum height is from 0.22mm
137KB
1265KB
64KB
241KB
150°C
High Temperature Application
Operating temperature range: Up to 150ºC
639KB
1030KB
65KB
241KB
150°C
High Temperature Application
Operating temperature range: Up to 150ºC
Voltage derating
639KB
889KB
65KB
241KB
Mega
MEGACAP
(with metal frame)
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure
300KB
1038KB
65KB
241KB
Mega I
LowR
MEGACAP
(Low Resistance, Inline)
Integration of high capacitance, high reliability and low resistance
(C0G type)
181KB
1027KB
65KB
241KB
Mega I
LowR
MEGACAP
(Low Resistance, Inline)
Integration of high capacitance, high reliability and low resistance
(X7x type)
181KB
898KB
65KB
241KB
Soft
Soft Termination
Resin relieves mechanical stress
(Up to 630Vdc)
656KB
983KB
65KB
241KB
Soft
Soft Termination
Resin relieves mechanical stress
(1k to 3kVdc)
656KB
918KB
65KB
241KB
Soft
LowR
Soft Termination
Low Resistance
Integration of both high reliability and low resistance
165KB
1490KB
65KB
241KB
L↔W
Low ESL
Reverse Geometry
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs
167KB
905KB
64KB
241KB
ULI
Low ESL
Ultra Low Inductance
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs
144KB
889KB
64KB
241KB