Multilayer Ceramic Chip Capacitors
Automotive Grade
| Product Image | Features | Features | Description | Product Catalog | Specification | RoHS Certificate | REACH Certificate | Part No. Lists |
|---|---|---|---|---|---|---|---|---|
 |
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
1143KB
|
1293KB
|
65KB
|
163KB
 |
 |
|
Rated voltage: Up to 75Vdc
Voltage derating |
1143KB
|
920KB
|
|
|||||
 |
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
683KB
|
1293KB
|
65KB
|
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
489KB
|
1140KB
|
65KB
|
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
584KB
|
1293KB
|
65KB
|
|
|
 |
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
293KB
|
1167KB
|
65KB
|
|
|
 |
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
421KB
|
907KB
|
115KB
|
|
|
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
915KB
|
|
||||||
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
993KB
|
1118KB
|
65KB
|
|
|
|
Resin relieves mechanical stress
(1k to 3kVdc) |
969KB
|
|
||||||
 |
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance
|
169KB
|
873KB
|
65KB
|
|
|
|
|
Serial
Soft |
Serial Design
Soft Termination |
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
182KB
|
946KB
|
65KB
|
|
|
|
|
Glue
|
Conductive Epoxy Application
|
AgPdCu termination reduces risk of silver migration
|
552KB
|
969KB
|
65KB
|
|
|
 |
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
153KB
|
982KB
|
64KB
|
|
|
 |
ESD
|
ESD Protection
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
165KB
|
973KB
|
65KB
|
|
| Product Image | Features | Features | Description | Product Catalog | Specification | RoHS Certificate | REACH Certificate | Part No. Lists |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
1143KB
|
1293KB
|
65KB
|
163KB
|
|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
Voltage derating |
1143KB
|
920KB
|
65KB
|
163KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
683KB
|
1293KB
|
65KB
|
163KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
489KB
|
1140KB
|
65KB
|
163KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
584KB
|
1293KB
|
65KB
|
163KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
293KB
|
1167KB
|
65KB
|
163KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
421KB
|
907KB
|
115KB
|
163KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(X7x type) |
421KB
|
915KB
|
115KB
|
163KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
993KB
|
1118KB
|
65KB
|
163KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(1k to 3kVdc) |
993KB
|
969KB
|
65KB
|
163KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance
|
169KB
|
873KB
|
65KB
|
163KB
|
|
|
|
Serial
Soft |
Serial Design
Soft Termination |
Serial structure decreases risk of short failures by crack
Resin relieves flexure stress |
182KB
|
946KB
|
65KB
|
163KB
|
|
|
|
Glue
|
Conductive Epoxy Application
|
AgPdCu termination reduces risk of silver migration
|
552KB
|
969KB
|
65KB
|
163KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
153KB
|
982KB
|
64KB
|
163KB
|
|
|
|
ESD
|
ESD Protection
|
Compliant with the IEC 61000-4-2 (level 4) for ESD immunity
|
165KB
|
973KB
|
65KB
|
163KB
|
|
Commercial Grade
| Product Image | Features | Features | Description | Product Catalog | Specification | RoHS Certificate | REACH Certificate | Part No. Lists |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Dimension: 0.4 x 0.2 [mm]
|
1626KB
|
850KB
|
65KB
|
163KB
|
|
|
Rated voltage: Up to 75Vdc
|
1107KB
|
|
||||||
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
778KB
|
65KB
|
|
||
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
520KB
|
860KB
|
65KB
|
|
|
 |
LowT
|
Low Profile
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
1265KB
|
64KB
|
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
639KB
|
1080KB
|
65KB
|
|
|
|
Operating temperature range: Up to 150ºC
Voltage derating |
889KB
|
|
||||||
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
999KB
|
65KB
|
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
419KB
|
916KB
|
65KB
|
|
|
|
Integration of high capacitance, high reliability and low resistance
(X7x type) |
876KB
|
|
||||||
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
656KB
|
1035KB
|
65KB
|
|
|
|
Resin relieves mechanical stress
(1k to 3kVdc) |
918KB
|
|
||||||
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance
|
165KB
|
1490KB
|
65KB
|
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
905KB
|
64KB
|
|
|
 |
ULI
|
Low ESL
Ultra Low Inductance |
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
144KB
|
889KB
|
64KB
|
|
| Product Image | Features | Features | Description | Product Catalog | Specification | RoHS Certificate | REACH Certificate | Part No. Lists |
|---|---|---|---|---|---|---|---|---|
|
|
General
|
General
(Up to 75Vdc) |
Dimension: 0.4 x 0.2 [mm]
|
1626KB
|
850KB
|
65KB
|
163KB
|
|
|
|
General
|
General
(Up to 75Vdc) |
Rated voltage: Up to 75Vdc
|
1626KB
|
1107KB
|
65KB
|
163KB
|
|
|
|
Mid
|
Mid Voltage
(100 to 630Vdc) |
Rated voltage: 100 to 630Vdc
|
778KB
|
1107KB
|
65KB
|
163KB
|
|
|
|
High
|
High Voltage
(1k to 3kVdc) |
Rated voltage: 1k to 3kVdc
|
520KB
|
860KB
|
65KB
|
163KB
|
|
|
|
LowT
|
Low Profile
|
Product height is lower than that of general products, and the available maximum height is from 0.22mm
|
137KB
|
1265KB
|
64KB
|
163KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
|
639KB
|
1080KB
|
65KB
|
163KB
|
|
|
|
150°C
|
High Temperature Application
|
Operating temperature range: Up to 150ºC
Voltage derating |
639KB
|
889KB
|
65KB
|
163KB
|
|
|
|
Mega
|
MEGACAP
(with metal frame) |
Metal frame relieves mechanical stress
Twice capacitance functions by stacked structure |
300KB
|
999KB
|
65KB
|
163KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(C0G type) |
419KB
|
916KB
|
65KB
|
163KB
|
|
|
|
Mega I
LowR |
MEGACAP
(Low Resistance, Inline) |
Integration of high capacitance, high reliability and low resistance
(X7x type) |
419KB
|
876KB
|
65KB
|
163KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(Up to 630Vdc) |
656KB
|
1035KB
|
65KB
|
163KB
|
|
|
|
Soft
|
Soft Termination
|
Resin relieves mechanical stress
(1k to 3kVdc) |
656KB
|
918KB
|
65KB
|
163KB
|
|
|
|
Soft
LowR |
Soft Termination
Low Resistance |
Integration of both high reliability and low resistance
|
165KB
|
1490KB
|
65KB
|
163KB
|
|
|
|
L↔W
|
Low ESL
Reverse Geometry |
Reduction in ESR/ESL and impedance due to the reverse geometry structure
Contributes to reduction in the number of decoupling MLCCs |
167KB
|
905KB
|
64KB
|
163KB
|
|
|
|
ULI
|
Low ESL
Ultra Low Inductance |
Reduction in ESR/ESL and impedance due to the unique structure
Contributes to reduction in the number of decoupling MLCCs |
144KB
|
889KB
|
64KB
|
163KB
|
|
