Multilayer Ceramic Chip Capacitors

FAQ

C1608X8R1E154M080AE

TDK item description  ?
C1608X8R1E154MT***S
Applications
Commercial GradeCommercial Grade
Please refer to Part No. CGA3E3X8R1E154M080AE for Automotive use.
Feature
150°CHigh Temperature Application
SoftSoft Termination
Series
C1608 [EIA 0603]
Status
Production (Not Recommended for New Design)Production (Not Recommended for New Design)
Recommended Alternate Part No. : C1608X8R1E154K080AE (Interchangeability is not guaranteed.)
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C1608
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.15,-0.10mm
Thickness(T)
0.80mm +0.15,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
150nF ±20%
Rated Voltage
25VDC
Temperature Characteristic  ?
X8R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
3333MΩ

Other

Operating Temp. Range
-55 to 150°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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Documents

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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