Multilayer Ceramic Chip Capacitors

FAQ

C1608X8R1H104M080AB

Product Status
Production (NRND)
Recommended Alternate Part No. : C1608X8R1H104K080AB (Interchangeability is not guaranteed.)
TDK Item Description Please refer to the FAQ about part number
C1608X8R1H104MT****
Applications
Commercial Grade
Please refer to Part No. CGA3E3X8R1H104M080AB for Automotive use.
Feature
150°CHigh Temperature Application
Series
C1608 [EIA 0603]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
1.60mm ±0.10mm
Width(W)
0.80mm ±0.10mm
Thickness(T)
0.80mm ±0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
100nF ±20%
Rated Voltage
50VDC
Temperature Characteristic
X8R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
5000MΩ

Other

Operating Temp. Range
-55 to 150°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
FIT (Failure In Time)
This will be displayed when you login to myTDK
Catalog

Distributor Stock Info

Save Page as PDF

Distributor List

Contact Us

Tech Info

Collapse all Expand all

Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph

This data is for reference only and does not guarantee product characteristics.