Multilayer Ceramic Chip Capacitors

TDK item description  ?
C1608X8R1H222MT***S
Applications
Commercial GradeCommercial Grade
Please refer to Part No. CGA3E2X8R1H222M080AE for Automotive use.
Feature
150°CHigh Temperature Application
SoftSoft Termination
Series
C1608 [EIA 0603]
Status
ProductionProduction

Images are for reference only and show exemplary products.

Size

Length(L)
1.60mm +0.20,-0.10mm
Width(W)
0.80mm +0.15,-0.10mm
Thickness(T)
0.80mm +0.15,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.30mm Min.
Recommended Land Pattern (PA)
0.70mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PB)
0.80mm to 1.00mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.60mm to 0.80mm(Flow Soldering)
0.60mm to 0.80mm(Reflow Soldering)

Electrical Characteristics

Capacitance
2.2nF ±20%
Rated Voltage
50VDC
Temperature Characteristic  ?
X8R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
10000MΩ

Other

Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)