Multilayer Ceramic Chip Capacitors

TDK item description  ?
C2012C0G1E103JT****
Applications
Commercial GradeCommercial Grade
Feature
GeneralGeneral (Up to 75V)
Series
C2012 [EIA 0805]
Status
ProductionProduction

Images are for reference only and show exemplary products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
0.60mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
10nF ±5%
Rated Voltage
25VDC
Temperature Characteristic  ?
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ

Other

Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)