Multilayer Ceramic Chip Capacitors

FAQ

C2012C0G1H153J085AE

Product Status
Production
TDK Item Description Please refer to the FAQ about part number
C2012C0G1H153JT***S
Applications
Commercial Grade
Please refer to Part No. CGA4F2C0G1H153J085AE for Automotive use.
Feature
SoftSoft Termination
Series
C2012 [EIA 0805]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
2.00mm +0.45,-0.20mm
Width(W)
1.25mm +0.25,-0.20mm
Thickness(T)
0.85mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
15nF ±5%
Rated Voltage
50VDC
Temperature Characteristic
C0G(0±30ppm/°C)
Q (Min.)
1000
Insulation Resistance (Min.)
10000MΩ
Allowable Voltage
Allowable Current

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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SIM-CAL STUDIO "Mid/High Voltage MLCC Configuration Proposal Tool"

This tool proposes a series and parallel configuration of multilayer ceramic chip capacitor from based on the driving conditions of the LC resonance circuit.

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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