Multilayer Ceramic Chip Capacitors
C2012C0G2E222K125AA
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Size
Length(L) |
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Width(W) |
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Thickness(T) |
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Terminal Width(B) |
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Terminal Spacing(G) |
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Recommended Land Pattern (PA) |
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Recommended Land Pattern (PB) |
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Recommended Land Pattern (PC) |
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Electrical Characteristics
Capacitance |
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Rated Voltage |
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Temperature Characteristic |
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Q (Min.) |
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Insulation Resistance (Min.) |
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Allowable Voltage |
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Allowable Current |
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Other
Operating Temp. Range |
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Soldering Method |
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AEC-Q200 |
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Packing |
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Package Quantity |
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FIT (Failure In Time) |
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Tech Info
Documents
Technical Support Tools
Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)
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Edc=50V
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Multilayer Ceramic Chip Capacitors
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Edc=6.3V
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LxWxT:3.2x1.6x1.6mm
General
AEC-Q200

EMI Suppression Capacitors
B32021H3332K003
0.0033 µF, 300 V rms AC
4.0m(W) x 9.0m(H) x 13.0m(L)

SMD / SMT Inductors (Coils)
B82432T1473K000
L=47μH
Rated current=0.5A
4.5mm x 3.2mm [EIA 1812]

SMD / SMT Inductors (Coils)
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L=3.3μH
Rated current=3.5A
L x W x T :
6.3 x 6 x 4.5mm

SMD / SMT Inductors (Coils)
VLS6045EX-221M-H
L=220μH
Rated current=0.5A
L x W x T :
6 x 6.3 x 4.5mm

Chip Beads
MMZ2012R601ATD25
|Z|=600Ω at 100MHz
Rated current=500mA
L x W x T :
2mm x 1.25mm x 0.85mm

Chip Beads
MPZ2012S102ATD25
|Z|=1000Ω at 100MHz
Rated current=1.5A
L x W x T :
2mm x 1.25mm x 0.85mm