Multilayer Ceramic Chip Capacitors

FAQ

C2012JB1H474M125AB

Product Status
Obsolete
Recommended Alternate Part No. : C2012X5R1H474K125AB (Interchangeability is not guaranteed.)
Discontinue Issue Date : May.11, 2023
Last Purchase Order Date : Jan.31, 2025
Last Shipment Date : Mar.31, 2025
TDK Item Description Please refer to the FAQ about part number
C2012JB1H474MT****
Applications
Commercial Grade
Feature
GeneralGeneral (Up to 75V)
Series
C2012 [EIA 0805]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
470nF ±20%
Rated Voltage
50VDC
Temperature Characteristic
JB(±10%)
Dissipation Factor (Max.)
5%
Insulation Resistance (Min.)
1063MΩ

Other

Operating Temp. Range
-25 to 85°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
FIT (Failure In Time)
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Characteristic Graph

This data is for reference only and does not guarantee product characteristics.