Multilayer Ceramic Chip Capacitors
C2012X5R1V105M085AB
|
|
Size
| Length(L) |
|
| Width(W) |
|
| Thickness(T) |
|
| Terminal Width(B) |
|
| Terminal Spacing(G) |
|
| Recommended Land Pattern (PA) |
|
| Recommended Land Pattern (PB) |
|
| Recommended Land Pattern (PC) |
|
Electrical Characteristics
| Capacitance |
|
| Rated Voltage |
|
| Temperature Characteristic |
|
| Dissipation Factor (Max.) |
|
| Insulation Resistance (Min.) |
|
Other
| Operating Temp. Range |
|
| Soldering Method |
|
| AEC-Q200 |
|
| Packing |
|
| Package Quantity |
|
| FIT (Failure In Time) |
|
Tech Info
Technical Support Tools
Characteristic Graph
Loading graph, please wait...
Customer who viewed this product also viewed
Multilayer Ceramic Chip Capacitors
C2012X5R1H105K125AB
Capacitance=1μF
Edc=50V
T.C.=X5R
LxWxT:2x1.25x1.25mm
General
Multilayer Ceramic Chip Capacitors
C2012X5R1V106K125AC
Capacitance=10μF
Edc=35V
T.C.=X5R
LxWxT:2x1.25x1.25mm
General
µPOL™ Embedded DC-DC Converters
FS1703-3300-AL
L x W x T :
3.3 x 3.3 x 1.5mm
Vin: 4.5 to 5.5V
Vout=3.3V, Iout=3A