Multilayer Ceramic Chip Capacitors

FAQ

C2012X7R1H104K125AM

TDK item description  ?
C2012X7R1H104KT5***
Applications
Commercial GradeCommercial Grade
Please refer to Part No. CGA4J2X7R1H104K125AM for Automotive use.
Feature
OpenOpen Mode
Series
C2012 [EIA 0805]
Status
EOL announcedEOL announced
Recommended Alternate Part No. : C1005X7R1H104K050BB (Interchangeability is not guaranteed.)
Discontinue Issue Date : May.11, 2023
Last Purchase Order Date : Jan.31, 2025
Last Shipment Date : Mar.31, 2025
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C2012
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
1.25mm ±0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
100nF ±10%
Rated Voltage
50VDC
Temperature Characteristic  ?
X7R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
5000MΩ

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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