Multilayer Ceramic Chip Capacitors

FAQ

C2012X7R2E332K085AM

TDK item description  ?
C2012X7R2E332KT5***
Applications
Commercial GradeCommercial Grade
Feature
MidMid Voltage (100 to 630V)
OpenOpen Mode
Series
C2012 [EIA 0805]
Status
Production (Not Recommended for New Design)Production (Not Recommended for New Design)
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C2012
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
2.00mm ±0.20mm
Width(W)
1.25mm ±0.20mm
Thickness(T)
0.85mm ±0.15mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
3.3nF ±10%
Rated Voltage
250VDC
Temperature Characteristic  ?
X7R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
10000MΩ

Other

Operating Temp. Range
-55 to 125°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Punched (Paper)Taping [180mm Reel]
Package Quantity
4000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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