Multilayer Ceramic Chip Capacitors

FAQ

C2012X8R1H104K125AE

Product Status
Production
TDK Item Description Please refer to the FAQ about part number
C2012X8R1H104KT***S
Applications
Commercial Grade
Please refer to Part No. CGA4J2X8R1H104K125AE for Automotive use.
Feature
150°CHigh Temperature Application
SoftSoft Termination
Series
C2012 [EIA 0805]
Brand
TDK
Environmental
Compliance Click to learn more about these icons
RoHSReachHalogen FreePb Free

Images are for reference only and show example products.

Size

Length(L)
2.00mm +0.45,-0.20mm
Width(W)
1.25mm +0.25,-0.20mm
Thickness(T)
1.25mm +0.25,-0.20mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
0.50mm Min.
Recommended Land Pattern (PA)
1.00mm to 1.30mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.00mm to 1.20mm(Flow Soldering)
0.70mm to 0.90mm(Reflow Soldering)
Recommended Land Pattern (PC)
0.80mm to 1.10mm(Flow Soldering)
0.90mm to 1.20mm(Reflow Soldering)

Electrical Characteristics

Capacitance
100nF ±10%
Rated Voltage
50VDC
Temperature Characteristic
X8R(±15%)
Dissipation Factor (Max.)
3%
Insulation Resistance (Min.)
5000MΩ

Other

Operating Temp. Range
-55 to 150°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
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Characteristic Graph

This data is for reference only and does not guarantee product characteristics.