Multilayer Ceramic Chip Capacitors

TDK item description  ?
C3216X6S0G686MT****
Applications
Commercial GradeCommercial Grade
Feature
GeneralGeneral (Up to 75V)
Series
C3216 [EIA 1206]
Status
ProductionProduction

Images are for reference only and show exemplary products.

Size

Length(L)
3.20mm +0.30,-0.10mm
Width(W)
1.60mm +0.30,-0.10mm
Thickness(T)
1.60mm +0.30,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
1.00mm Min.
Recommended Land Pattern (PA)
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)

Electrical Characteristics

Capacitance
68μF ±20%
Rated Voltage
4VDC
Temperature Characteristic  ?
X6S(±22%)
Dissipation Factor (Max.)
10%
Insulation Resistance (Min.)
1MΩ

Other

Soldering Method
Wave (Flow)
Reflow
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)