Multilayer Ceramic Chip Capacitors

FAQ

C3216X6S1E226M160AC

TDK item description  ?
C3216X6S1E226MT****
Applications
Commercial GradeCommercial Grade
Feature
GeneralGeneral (Up to 75V)
Series
C3216 [EIA 1206]
Status
ProductionProduction
Brand
TDK
  • MLCC,Multilayer Ceramic Chip Capacitors:C3216
  • MLCC,Multilayer Ceramic Chip Capacitors

Images are for reference only and show example products.

Size

Length(L)
3.20mm +0.30,-0.10mm
Width(W)
1.60mm +0.30,-0.10mm
Thickness(T)
1.60mm +0.30,-0.10mm
Terminal Width(B)
0.20mm Min.
Terminal Spacing(G)
1.00mm Min.
Recommended Land Pattern (PA)
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PB)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
Recommended Land Pattern (PC)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)

Electrical Characteristics

Capacitance
22μF ±20%
Rated Voltage
25VDC
Temperature Characteristic  ?
X6S(±22%)
Dissipation Factor (Max.)
7.5%
Insulation Resistance (Min.)
22MΩ

Other

Operating Temp. Range
-55 to 105°C
Soldering Method
Wave (Flow)
Reflow
AEC-Q200
NO
Packing
Embossed (Plastic)Taping [180mm Reel]
Package Quantity
2000pcs
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Documents

Technical Support Tools

3rd Party ECAD models

  • SnapMagic
    SnapMagic

Characteristic Graph (This is reference data, and does not guarantee the products characteristics.)

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